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XCKU035-1FBVA676C

Name: AMD XCKU035-1FBVA676C
Brand: AMD / Xilinx
SKU: 217-CKU035-1FBVA676C
Price: 24626975.13 IDR
Availability: OutOfStock

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Mouser No:

217-CKU035-1FBVA676C

Mfr. No:

XCKU035-1FBVA676C

Mfr.:

AMD / Xilinx

Description:

FPGA - Field Programmable Gate Array XCKU035-1FBVA676C

Datasheet:

XCKU035-1FBVA676C Datasheet (PDF)

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Factory Lead Time:: 22 Weeks Estimated factory production time.

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	Rp24.626.975,13	Rp24.626.975,13

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	AMD
Product Category:	FPGA - Field Programmable Gate Array
RoHS:
Series:	XCKU035
Number of Logic Elements:	444343 LE
Adaptive Logic Modules - ALMs:	25391 ALM
Embedded Memory:	19 Mbit
Number of I/Os:	312 I/O
Supply Voltage - Min:	922 mV
Supply Voltage - Max:	979 mV
Minimum Operating Temperature:	0 C
Maximum Operating Temperature:	+ 85 C
Data Rate:	16.3 Gb/s
Number of Transceivers:	16 Transceiver
Mounting Style:	SMD/SMT
Package/Case:	FBGA-676
Brand:	AMD / Xilinx
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Distributed RAM:	5.9 Mbit
Embedded Block RAM - EBR:	19 Mbit
Moisture Sensitive:	Yes
Number of Logic Array Blocks - LABs:	25391 LAB
Operating Supply Voltage:	850 mV
Product Type:	FPGA - Field Programmable Gate Array
Factory Pack Quantity:	40
Subcategory:	Programmable Logic ICs
Tradename:	Kintex UltraScale
Unit Weight:	45,360 g

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Datasheet

XCKU035-1FBVA676C Datasheet (PDF)

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USHTS:: 8542310060
TARIC:: 8542399000
ECCN:: 3A991.d

Kintex™ UltraScale+™ FPGAs

AMD / Xilinx Kintex™ UltraScale+™ Field Programmable Gate Arrays (FPGAs) feature the highest signal processing bandwidth in mid-range, next-generation transceivers. AMD / Xilinx Kintex UltraScale+ FPGAs are available for packet processing in 100G networking and data center applications. The FPGAs are also ideal for DSP-intensive processing needed in next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure. Kintex UltraScale+ FPGAs are optimized for system performance and integration at 20nm and enabled by monolithic and next-generation stacked silicon interconnect (SSI) technology.