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ATS-1148-C1-R0

Name: Advanced Thermal Solutions ATS-1148-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-1148-C1-R0
Price: 408496 IDR
Availability: InStock

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Mouser No:

984-ATS-1148-C1-R0

Mfr. No:

ATS-1148-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW Power Brick Heat Sink, Full Brick, T766, 61x118x6.1mm, 118mm Dia

Datasheet:

ATS-1148-C1-R0 Datasheet (PDF)

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In Stock: 7

Stock:: 7 Can Dispatch Immediately

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp408.496	Rp408.496
	Rp385.900	Rp3.859.000
	Rp363.127	Rp7.262.540
	Rp340.530	Rp17.026.500
	Rp317.758	Rp31.775.800
	Rp301.117	Rp60.223.400
	Rp291.833	Rp145.916.500

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	DC/DC Converter, Full Brick
Mounting Style:	Screw
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	2.4 C/W
Length:	61 mm
Width:	118 mm
Height:	6.1 mm
Brand:	Advanced Thermal Solutions
Color:	Gold
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	Brick HS
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW
Type:	DC/DC Converter

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Datasheet

ATS-1148-C1-R0 Datasheet (PDF)

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Technical Resources

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
USHTS:: 8504909690
TARIC:: 7616991099
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.