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ATS-51270D-C1-R0

Name: Advanced Thermal Solutions ATS-51270D-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-51270D-C1-R0
Price: 292709 IDR
Availability: InStock

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Mouser No:

984-ATS-51270D-C1-R0

Mfr. No:

ATS-51270D-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW BGA Heat Sink+maxiGRIP Attachment, T766, 27x27x9.5mm, 43.2mm Fin Tip

Datasheet:

ATS-51270D-C1-R0 Datasheet (PDF)

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In Stock: 2

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp292.709	Rp292.709
	Rp274.141	Rp2.741.410
	Rp258.025	Rp5.160.500
	Rp241.910	Rp12.095.500
	Rp229.298	Rp22.929.800
	Rp216.160	Rp43.232.000
	Rp210.379	Rp105.189.500

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Mounting Style:	Snap On
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	7.99 C/W
Length:	27 mm
Width:	27 mm
Height:	9.5 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	maxiGRIP HS ASM
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW maxiGRIP
Type:	Component
Unit Weight:	11,600 g

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Datasheet

ATS-51270D-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
USHTS:: 8542900000
TARIC:: 7616991099
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.