ATS-52350P-C1-R0

Advanced Thermal Solutions
984-ATS-52350P-C1-R0
ATS-52350P-C1-R0

Mfr.:

Description:
Heat Sinks maxiFLOW BGA Heat Sink, Double-Side Thermal Tape, T412, 35mm L, 35mm W, 17.5mm H

Datasheet:
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In Stock: 60

Stock:
60 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 60 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
Rp-,--
Ext. Price:
Rp-,--
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp274.666,56 Rp274.666,56
Rp243.135,96 Rp2.431.359,60
Rp231.749,91 Rp4.634.998,20
Rp223.341,75 Rp11.167.087,50
Rp215.108,76 Rp21.510.876,00
Rp202.846,86 Rp40.569.372,00
Rp197.416,59 Rp98.708.295,00
2.000 Quote

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
Thermal Tape, Adhesive (Included)
Aluminum
Square Fin
2.30 deg C/W
1.378" (35.00mm)
1.378" (35.00mm)
0.689" (17.50mm)
Brand: Advanced Thermal Solutions
Color: Blue
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Packaging: Bulk
Product Type: Heat Sinks
Series: HS with TAPE
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW
Type: Top Mount
Part # Aliases: ATS-50375P-C2-HS
Unit Weight: 17,500 g
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Attributes selected: 0

Datasheet

Test/Quality Data

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CNHTS:
7616991090
USHTS:
8542900000
TARIC:
7616991099
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

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