ATS-61450K-C1-R0

Advanced Thermal Solutions
984-ATS-61450K-C1-R0
ATS-61450K-C1-R0

Mfr.:

Description:
Heat Sinks BGA fanSINK with maxiGRIP Attachment, T412, 44.25x44.25x14.5mm, 44.25mm dia.

Datasheet:
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Learn more about Advanced Thermal Solutions ATS-61450K-C1-R0

In Stock: 8

Stock:
8 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 8 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
Rp-,--
Ext. Price:
Rp-,--
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp407.970,93 Rp407.970,93
Rp385.374,00 Rp3.853.740,00
Rp362.777,07 Rp7.255.541,40
Rp340.180,14 Rp17.009.007,00
Rp317.408,04 Rp31.740.804,00
Rp300.766,89 Rp60.153.378,00
Rp291.482,88 Rp145.741.440,00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Fan Sink Assemblies
BGA
Snap On
Aluminum
Cross Cut Fin
2.4 C/W
45 mm
45 mm
14.5 mm
Brand: Advanced Thermal Solutions
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Packaging: Bulk
Product Type: Heat Sinks
Series: ATS-61
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: fanSINK maxiGRIP
Type: Component
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Attributes selected: 0

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CNHTS:
7616991090
USHTS:
7616995190
TARIC:
7616991099
MXHTS:
7616995195
ECCN:
EAR99

fanSINK™ High Performance Heat Sinks

Advanced Thermal Solutions, Inc. (ATS) fanSINK™ High-Performance Heat Sinks feature a cross-cut straight-fin structure that allows for omnidirectional airflow for optimal thermal performance independent of the PCB layout. Depending on their size, the fanSINK can be securely clipped onto a device with the ATS maxiGRIP™ attachment system or by using standoff and spring hardware for direct attachment to the PCB. The stainless-steel screw fan attachment ensures a dependable long-term fan-to-heat sink connection (fan not included). These heat sinks include pre-assembled thermal interface material (TIM) centered on the base to ensure proper thermal transfer between the component and heat sink.

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