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ATS-61700D-C2-R0

Name: Advanced Thermal Solutions ATS-61700D-C2-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-61700D-C2-R0
Price: 459470.91 IDR
Availability: OutOfStock

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Mouser No:

984-ATS-61700D-C2-R0

Mfr. No:

ATS-61700D-C2-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks fanSINK Assembly w/Mounting Hardware, Black, T766, 73.85mm L, 73.85mm W, 9.5mm H

Datasheet:

ATS-61700D-C2-R0 Datasheet (PDF)

ECAD Model:

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Learn more about Advanced Thermal Solutions ATS-61700D-C2-R0

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 8 Weeks Estimated factory production time.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp459.470,91	Rp45.947.091,00
	Rp437.574,66	Rp87.514.932,00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Fan Sink Assemblies
Designed for:	BGA
Mounting Style:	Clip
Heatsink Material:	Aluminum
Fin Style:	Cross Cut Fin
Thermal Resistance:	1.1 C/W
Length:	73.85 mm
Width:	73.85 mm
Height:	9.5 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	ATS-61
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	fanSINK
Type:	Component

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Technical Resources

Videos

ATS fanSINK Heat Sink Family Overview

CERTIFICATE OF RoHS and REACH 205 COMPLIANCE (PDF)

USHTS:: 8542900000
ECCN:: EAR99

fanSINK™ High Performance Heat Sinks

Advanced Thermal Solutions, Inc. (ATS) fanSINK™ High-Performance Heat Sinks feature a cross-cut straight-fin structure that allows for omnidirectional airflow for optimal thermal performance independent of the PCB layout. Depending on their size, the fanSINK can be securely clipped onto a device with the ATS maxiGRIP™ attachment system or by using standoff and spring hardware for direct attachment to the PCB. The stainless-steel screw fan attachment ensures a dependable long-term fan-to-heat sink connection (fan not included). These heat sinks include pre-assembled thermal interface material (TIM) centered on the base to ensure proper thermal transfer between the component and heat sink.