ATS-KRP-3563-C1-R0

Advanced Thermal Solutions
984-ATS-KRP-3563C1R1
ATS-KRP-3563-C1-R0

Mfr.:

Description:
Heat Sinks maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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Learn more about Advanced Thermal Solutions ATS-KRP-3563-C1-R0

In Stock: 98

Stock:
98 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-,--
Ext. Price:
Rp-,--
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp550.909,65 Rp550.909,65
Rp504.314,43 Rp5.043.144,30
Rp472.783,83 Rp9.455.676,60
Rp447.559,35 Rp22.377.967,50
Rp431.268,54 Rp43.126.854,00
Rp410.773,65 Rp82.154.730,00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Brand: Advanced Thermal Solutions
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Packaging: Tray
Product Type: Heat Sinks
Series: ATS-KR
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: AMD Xilinx Kria/maxiFLOW
Unit Weight: 61 g
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Attributes selected: 0

Datasheet

Certificates

Models

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CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

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