ATS-X50230G-C1-R0

Name: Advanced Thermal Solutions ATS-X50230G-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-X50230G-C1-R0
Price: 443706 IDR
Availability: OutOfStock

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Mouser No:

984-X50230G-C1-R0

Mfr. No:

ATS-X50230G-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW Heat Sink+superGRIP Attach, High Performance, T766, 22.25x22.25x12.5mm

Datasheet:

ATS-X50230G-C1-R0 Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 8 Weeks Estimated factory production time.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp443.706	Rp443.706
	Rp419.182	Rp4.191.820
	Rp394.483	Rp7.889.660
	Rp369.784	Rp18.489.200
	Rp345.085	Rp34.508.500
	Rp327.042	Rp65.408.400
	Rp317.058	Rp158.529.000

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Heatsink Material:	Aluminum
Fin Style:	maxiFLOW
Thermal Resistance:	6.7 C/W
Length:	23 mm
Width:	23 mm
Height:	12.5 mm
Brand:	Advanced Thermal Solutions
Color:	Blue
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	superGRIP HS ASM
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW superGRIP
Type:	Component

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Datasheet

ATS-X50230G-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.