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ATS-X51190R-C1-R0

Name: Advanced Thermal Solutions ATS-X51190R-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-X51190R-C1R0
Price: 376265 IDR
Availability: OutOfStock

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Mouser No:

984-ATS-X51190R-C1R0

Mfr. No:

ATS-X51190R-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW Heat Sink+superGRIP Attachment, Low Profile, T766, 18.25x18.25x19.5mm

Datasheet:

ATS-X51190R-C1-R0 Datasheet (PDF)

ECAD Model:

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Learn more about Advanced Thermal Solutions ATS-X51190R-C1-R0

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 8 Weeks Estimated factory production time.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp376.265	Rp37.626.500
	Rp358.398	Rp71.679.600
	Rp350.515	Rp175.257.500

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Mounting Style:	Clip
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	7.5 C/W
Length:	18.25 mm
Width:	18.25 mm
Height:	19.5 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	superGRIP HS ASM
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW superGRIP
Type:	Component

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Datasheet

ATS-X51190R-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.