ATS-X51375D-C1-R0

Advanced Thermal Solutions
984-ATS-X51375D-C1R0
ATS-X51375D-C1-R0

Mfr.:

Description:
Heat Sinks maxiFLOW superGRIP Heat Sink Assembly, T766, Black-Anodize, 36.75x36.75x9.5mm

Datasheet:
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Learn more about Advanced Thermal Solutions ATS-X51375D-C1-R0

In Stock: 100

Stock:
100 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 100 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
Rp-,--
Ext. Price:
Rp-,--
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp461.222,61 Rp461.222,61
Rp435.647,79 Rp4.356.477,90
Rp410.072,97 Rp8.201.459,40
Rp384.498,15 Rp19.224.907,50
Rp358.748,16 Rp35.874.816,00
Rp340.004,97 Rp68.000.994,00
Rp329.494,77 Rp164.747.385,00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sink Assemblies
BGA
Clip
Aluminum
Angled Fin
4.9 C/W
36.75 mm
36.75 mm
9.5 mm
Brand: Advanced Thermal Solutions
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Packaging: Bulk
Product Type: Heat Sinks
Series: superGRIP HS ASM
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW superGRIP
Type: Component
Products found:
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Attributes selected: 0

Datasheet

Test/Quality Data

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CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

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