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ATS015015007-PF-4F

Name: Advanced Thermal Solutions ATS015015007-PF-4F
Brand: Advanced Thermal Solutions
SKU: 984-ATS015015007PF4F
Price: 94066.29 IDR
Availability: InStock

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Mouser No:

984-ATS015015007PF4F

Mfr. No:

ATS015015007-PF-4F

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Cross Cut, No TIM, 15x15x7mm

Datasheet:

ATS015015007-PF-4F Datasheet (PDF)

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp94.066,29	Rp94.066,29
	Rp89.336,70	Rp893.367,00
	Rp86.884,32	Rp1.737.686,40
	Rp81.979,56	Rp4.098.978,00
	Rp77.249,97	Rp7.724.997,00
	Rp72.345,21	Rp14.469.042,00
	Rp69.892,83	Rp34.946.415,00
	Rp65.163,24	Rp65.163.240,00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Fin Style:	Pin Fin
Brand:	Advanced Thermal Solutions
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	BGA High Aspect Ratio
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	Value-Line Platform
Type:	Component
Unit Weight:	4 g

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Datasheet

ATS015015007-PF-4F Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
CAHTS:: 3926909990
USHTS:: 3926909989
JPHTS:: 392690029
TARIC:: 3926909790
ECCN:: EAR99

Pin Fin Value-Line Heat Sinks

Advanced Thermal Solutions Pin Fin Value-Line Heat Sinks are engineered with thin and dense fields of pin-shaped cooling fins. These heat sinks are fabricated from extruded aluminum to minimize thermal resistance from the base to the fins. This process reduces weight and keeps the cost low. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm, and height ranges from 2mm to 25mm with 1mm increments. The pin fin heat sinks feature large surface areas that increase heat sink performance and provide high-efficiency and low-pressure drop characteristics. These heat sinks can be attached to the devices with double-sided thermal adhesive, Z-clip, or maxiGRIP™ technologies. The custom pin fin design offers an excellent cooling solution for spatially constrained PCB layouts when the airflow direction near the device is ambiguous.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.