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CQB-AU100-23um

Name: Chip Quik CQB-AU100-23um
Brand: Chip Quik
SKU: 910-CQB-AU100-23UM
Price: 12212852 IDR
Availability: OutOfStock

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Mouser No:

910-CQB-AU100-23UM

Mfr. No:

CQB-AU100-23um

Mfr.:

Chip Quik

Description:

Solder Gold Bonding Wire (Au100) Gold 23um (0.9mil) (Solid Core)

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

CQB-AU100-23um Datasheet (PDF)

More Information

Learn more about Chip Quik CQB-AU100-23um

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp12.212.852	Rp12.212.852

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Chip Quik
Product Category:	Solder
RoHS:
Product:	Solder Wire
Diameter:	23 um
Package Type:	Spool
Brand:	Chip Quik
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	Solder
Series:	CQB
Factory Pack Quantity:	1
Subcategory:	Solder & Equipment

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Datasheet

CQB-AU100-23um Datasheet (PDF)

CAHTS:: 8311900000
USHTS:: 8311900000
JPHTS:: 831190000
TARIC:: 8311900000
BRHTS:: 83119000
ECCN:: EAR99

CQB Gold Bonding Wires

Chip Quik CQB Gold Bonding Wires are made of high-purity gold >99.99% and are designed specifically for wire bonding. These bonding wires are stored in a dry, non-corrosive environment and offer excellent electrical conductivity, stability, and resistance to corrosion. The CQB wires are available in 23µm and 25µm diameters. These wires connect electrical components in industries and electrically connect microchip dies to the terminals of a chip package or directly to a substrate. The CQB bonding wires are RoHS 3 compliant, REACH compliant, and conform to J-STD-006C standard. These wires are used by Integrated Circuit (IC) packaging shops, research labs, and advanced manufacturing facilities. The CQB gold bonding wires are ideal for electronics, aerospace, and medicine.