140-510-415-100

EDAC
587-140-510-415-100
140-510-415-100

Mfr.:

Description:
Headers & Wire Housings 140 Series Wire to Board in-line 2.0mm pitch connector with 10 P.C. board through hole contacts, side entry

ECAD Model:
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In Stock: 963

Stock:
963 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp8.408 Rp8.408
Rp7.252 Rp72.520
Rp6.359 Rp158.975
Rp5.623 Rp562.300
Rp5.045 Rp1.261.250
Rp3.573 Rp3.573.000
Rp3.468 Rp17.340.000
Rp3.381 Rp33.810.000

Product Attribute Attribute Value Select Attribute
EDAC
Product Category: Headers & Wire Housings
RoHS:  
Headers
Shrouded
10 Position
2 mm (0.079 in)
1 Row
PCB Mount
Solder Pin
Right Angle
Pin (Male)
Tin
140
Wire-to-Board
- 40 C
+ 105 C
Brand: EDAC
Contact Material: Brass
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 2 A
Flammability Rating: UL 94 V-0
Housing Colour: Natural
Housing Material: Polyamide (PA)
Insulation Resistance: 1 GOhms
Product Type: Headers & Wire Housings
Factory Pack Quantity: 1
Subcategory: Headers & Wire Housings
Voltage Rating: 100 V
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USHTS:
8536694040
ECCN:
EAR99

140 Series 2mm Wire-to-Board Connectors

EDAC 140 Series 2mm Wire-to-Board Connectors are available in various positions with top-entry or side-entry configurations. Additional variations include right-angle, vertical, and SMT or through-hole mounted to the PCB. These inline connectors are designed for the high-density connection of internal wires to PCBs with a thickness of 1.2mm to 1.6mm. They have a 2A current rating and a low-profile insulator body with a 6.1mm height and 4.70mm width. They operate in a -40°C to +105°C temperature range. EDAC 140 Series 2mm Wire-to-Board Connectors are compatible with leading industry connectors as drop-in replacements and ideal for use in wire harness applications.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.