MCL2012V2-221-R

Eaton Electronics
504-MCL2012V2-221-R
MCL2012V2-221-R

Mfr.:

Description:
RF Inductors - SMD MCL Chip IND 2012 220nH 2 Pads

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
12 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp1.752 Rp1.752
Rp490 Rp4.900
Rp455 Rp45.500
Rp420 Rp420.000
Full Reel (Order in multiples of 4000)
Rp350 Rp1.400.000

Similar Products

Product Attribute Attribute Value Select Attribute
Eaton
Product Category: RF Inductors - SMD
RoHS:  
Multilayer
0805 (2012 metric)
Unshielded
220 nH
5 %
300 mA
500 mOhms
- 40 C
+ 85 C
2 mm
1.2 mm
0.9 mm
MCL
Reel
Cut Tape
Application: High Frequency
Brand: Eaton Electronics
Case Code - in: 0805
Case Code - mm: 2012
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 4000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Unit Weight: 10 mg
Products found:
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Attributes selected: 0

Datasheet

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CNHTS:
8504500000
USHTS:
8504508000
TARIC:
8504509590
ECCN:
EAR99

MCL Multilayer Chip Inductors

Eaton Electronics MCL Multilayer Chip Inductors feature multilayer monolithic construction for high reliability and are suitable for wave and reflow soldering. These inductors are available in three variants: MCL1005, MCL1608V1, and MCL2012V1. The MCL1005 inductors offer high self-resonant frequency (SRF) and a 1nH to 360nH inductance range. The MCL1608V1 inductors operate at a 0.47µH to 12µH inductance range, and the MCL2012V1 inductors have a 0.047uH to 22uH inductance range. Eaton MCL Multilayer Chip Inductors are moisture sensitivity level (MSL) 1. Typical applications include industrial connectivity, wireless communications, wearable devices, broadband components, and RF transceiver modules.

5G Applications

Eaton Electronics offers an expansive portfolio of high-reliability components needed to drive 5G forward. Because 5G telecommunication units are typically placed in rugged environments, continuous uptime requirements for their operation and the reliability of the internal electronics are of great importance. A variety of components, often passives, can be readily added in key locations within 5G communications systems to enhance reliability and mitigate subcircuits susceptible to electrostatic discharge (ESD), electromagnetic interference (EMI), and electromagnetic pulse (EMP). Eaton 5G products can withstand harsh environments while delivering high performance.

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