2508056007Y6

Fair-Rite
623-2508056007Y6
2508056007Y6

Mfr.:

Description:
Ferrite Beads MultLyr Chip Bead 60 OHM 0805 6000mA

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Learn more about Fair-Rite 2508056007Y6

In Stock: 32.555

Stock:
32.555 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-,--
Ext. Price:
Rp-,--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (IDR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
Rp2.102,04 Rp2.102,04
Rp1.436,39 Rp14.363,90
Rp1.121,09 Rp28.027,25
Rp1.015,99 Rp101.599,00
Rp875,85 Rp218.962,50
Rp770,75 Rp385.375,00
Rp683,16 Rp683.160,00
Full Reel (Order in multiples of 4000)
Rp560,54 Rp2.242.160,00
Rp525,51 Rp4.204.080,00
† A MouseReel™ fee of Rp98.000,00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
0805 (2012 metric)
60 Ohms
6 A
25 %
20 mOhms
- 55 C
+ 125 C
2 mm
1.25 mm
0.9 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Factory Pack Quantity: 4000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer Ferrite Chip Bead
Unit Weight: 5,500 mg
Products found:
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Attributes selected: 0

CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
TARIC:
8504509590
MXHTS:
85049099
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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