HDTM-3-04-1-S-VT-0-2

Samtec
200-HDTM-3041SVT02
HDTM-3-04-1-S-VT-0-2

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:
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Learn more about Samtec HDTM-3-04-1-S-VT-0-2

Availability

Stock:
Non-Stocked
Factory Lead Time:
2 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
Rp-,--
Ext. Price:
Rp-,--
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp125.947,23 Rp125.947,23
Rp109.130,91 Rp2.728.272,75
Rp92.314,59 Rp5.538.875,40
Rp67.090,11 Rp8.050.813,20
Rp58.331,61 Rp31.499.069,40
Rp53.076,51 Rp54.138.040,20
Rp46.069,71 Rp116.095.669,20
Rp38.887,74 Rp195.994.209,60

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
RoHS:  
Headers
4 Row
1.8 mm
Solder Pin
Gold
HDTM
Tray
Brand: Samtec
Contact Material: Copper Alloy
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Housing Colour: Black
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 40 C
Mounting Angle: Vertical
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 60
Subcategory: Backplane Connectors
Tradename: XCede
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Attributes selected: 0

Datasheet

Technical Resources

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.

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