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HDTM-3-06-1-S-VT-5-R-2

Name: Samtec HDTM-3-06-1-S-VT-5-R-2
Brand: Samtec
SKU: 200-HDTM3061SVT5R2
Price: 153449 IDR
Availability: InStock

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Mouser No:

200-HDTM3061SVT5R2

Mfr. No:

HDTM-3-06-1-S-VT-5-R-2

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:

HDTM-3-06-1-S-VT-5-R-2 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-3-06-1-S-VT-5-R-2

In Stock: 38

Stock:: 38 Can Dispatch Immediately

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Factory Lead Time:: 1 Week Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp153.449	Rp153.449
	Rp130.502	Rp1.305.020
	Rp122.269	Rp3.056.725
	Rp121.393	Rp5.826.864
	Rp112.109	Rp32.287.392
	Rp106.503	Rp56.233.584
	Rp98.095	Rp98.879.760
	Rp89.337	Rp180.103.392

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	36 Position
Number of Rows:	6 Row
Pitch:	1.8 mm
Termination Style:	Press Fit
Contact Plating:	Gold
Packaging:	Tray
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	48
Subcategory:	Backplane Connectors

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Datasheet

HDTM-3-06-1-S-VT-5-R-2 Datasheet (PDF)

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Specification Sheets

Technical Resources

Test Report (PDF)

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.