HDTM-3-08-1-S-VT-5-R-2

Samtec
200-HDTM3081SVT5R2
HDTM-3-08-1-S-VT-5-R-2

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
4 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp214.058 Rp214.058
Rp193.037 Rp1.930.370
Rp172.017 Rp4.300.425
Rp140.486 Rp11.800.824
Rp125.597 Rp31.650.444
Rp115.787 Rp58.356.648
Rp103.525 Rp104.353.200
Rp91.264 Rp183.988.224

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
Headers
48 Position
8 Row
1.8 mm
Solder Pin
Tray
Brand: Samtec
Contact Material: Phosphor Bronze
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 1.5 A
Housing Material: Liquid Crystal Polyer (LCP)
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 40 C
Mounting Angle: Vertical
Orientation: Straight
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 42
Subcategory: Backplane Connectors
Voltage Rating: 48 VAC
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Attributes selected: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.