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HDTM-3-08-2-S-VT-5-R-1

Name: Samtec HDTM-3-08-2-S-VT-5-R-1
Brand: Samtec
SKU: 200-HDTM3082SVT5R1
Price: 222641.07 IDR
Availability: OutOfStock

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Mouser No:

200-HDTM3082SVT5R1

Mfr. No:

HDTM-3-08-2-S-VT-5-R-1

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:

HDTM-3-08-2-S-VT-5-R-1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-3-08-2-S-VT-5-R-1

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 3 Weeks Estimated factory production time.

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Minimum: 1 Multiples: 1

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp222.641,07	Rp222.641,07
	Rp200.919,99	Rp2.009.199,90
	Rp178.848,57	Rp4.471.214,25
	Rp146.091,78	Rp12.271.709,52
	Rp130.501,65	Rp32.886.415,80
	Rp120.166,62	Rp60.563.976,48
	Rp107.204,04	Rp108.061.672,32
	Rp94.416,63	Rp190.343.926,08

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Packaging:	Tray
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	42
Subcategory:	Backplane Connectors

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Datasheet

HDTM-3-08-2-S-VT-5-R-1 Datasheet (PDF)

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.