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HDTM-6-08-1-S-VT-5-R-1

Name: Samtec HDTM-6-08-1-S-VT-5-R-1
Brand: Samtec
SKU: 200-HDTM6081SVT5R1
Price: 384323 IDR
Availability: OutOfStock

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See Product Specifications

Mouser No:

200-HDTM6081SVT5R1

Mfr. No:

HDTM-6-08-1-S-VT-5-R-1

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-6-08-1-S-VT-5-R-1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-6-08-1-S-VT-5-R-1

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 3 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp384.323	Rp384.323
	Rp355.945	Rp3.559.450
	Rp327.568	Rp9.827.040
	Rp284.826	Rp17.089.560
	Rp247.165	Rp29.659.800
	Rp224.918	Rp60.727.860
	Rp195.139	Rp99.520.890
	Rp165.536	Rp168.846.720

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Packaging:	Tray
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	30
Subcategory:	Backplane Connectors

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Datasheet

HDTM-6-08-1-S-VT-5-R-1 Datasheet (PDF)

Conflict Material Declaration (Spreadsheet)

USHTS:: 8536694040
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.