HDTM-6-08-1-S-VT-5-R-3

Samtec
200-HDTM6081SVT5R3
HDTM-6-08-1-S-VT-5-R-3

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 15

Stock:
15 Can Dispatch Immediately
Factory Lead Time:
2 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp370.835 Rp370.835
Rp355.945 Rp3.559.450
Rp309.000 Rp9.270.000
Rp295.512 Rp17.730.720
Rp274.491 Rp32.938.920
Rp258.551 Rp69.808.770
Rp240.859 Rp122.838.090
1.020 Quote

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
Tray
Brand: Samtec
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 30
Subcategory: Backplane Connectors
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CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.