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QSS-032-01-F-D-DP-RA-WT

Name: Samtec QSS-032-01-F-D-DP-RA-WT
Brand: Samtec
SKU: 200-QSS03201FDDPRAWT
Price: 283951 IDR
Availability: OutOfStock

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See Product Specifications

Mouser No:

200-QSS03201FDDPRAWT

Mfr. No:

QSS-032-01-F-D-DP-RA-WT

Mfr.:

Samtec

Description:

Board to Board & Mezzanine Connectors 0.635 mm Q Strip High-Speed Ground Plane Socket Strip

Datasheet:

QSS-032-01-F-D-DP-RA-WT Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec QSS-032-01-F-D-DP-RA-WT

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 12 Weeks Estimated factory production time.

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Ext. Price:

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp283.951	Rp283.951
	Rp275.542	Rp2.755.420
	Rp268.536	Rp6.713.400
	Rp215.459	Rp24.131.408
	Rp182.527	Rp46.726.912
	Rp153.274	Rp78.476.288
	Rp126.473	Rp127.484.784

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Sockets
Number of Positions:	64 Position
Pitch:	0.635 mm (0.025 in)
Number of Rows:	2 Row
Termination Style:	Solder
Mounting Angle:	Right Angle
Current Rating:	1.8 A
Voltage Rating:	285 VAC
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Phosphor Bronze
Housing Material:	Liquid Crystal Polymer (LCP)
Series:	QSS
Packaging:	Tray
Application:	Power, Signal
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CR
Flammability Rating:	UL 94 V-0
Mounting Style:	Mounting Peg
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	16
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	Q Strip

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Datasheet

QSS-032-01-F-D-DP-RA-WT Datasheet (PDF)

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Q Strip™ High-Speed Mezzanine Connectors

Samtec Q Strip™ High-Speed Mezzanine Connectors are designed for high-speed board-to-board applications where signal integrity is essential. Q Strip connectors have surface-mount signal contacts and a surface-mount ground plane between the two rows of signals for improved electrical performance. Mated sets of Samtec Q Strip connectors are available in 8 different stack heights from 5mm (.197") to 30mm (1.180"). Options include guideposts for blind mate scenarios and alignment pins and locking clips for proper connector placement before reflow.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.