TMP110D1IDPWR

Texas Instruments
595-TMP110D1IDPWR
TMP110D1IDPWR

Mfr.:

Description:
Board Mount Temperature Sensors +/-1.0C accurate IC temperature sensor w

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-,--
Ext. Price:
Rp-,--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 3000)

Pricing (IDR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
Rp5.780,61 Rp5.780,61
Rp5.009,86 Rp25.049,30
Rp4.396,77 Rp43.967,70
Rp4.169,05 Rp208.452,50
Rp3.958,84 Rp395.884,00
Rp3.538,43 Rp1.769.215,00
Rp3.398,30 Rp3.398.300,00
Rp3.153,06 Rp6.306.120,00
Full Reel (Order in multiples of 3000)
Rp3.012,92 Rp9.038.760,00
† A MouseReel™ fee of Rp98.000,00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Board Mount Temperature Sensors
RoHS:  
Digital
+/- 1 C
- 40 C
+ 125 C
X2SON-5
I2C
1.14 V
5.5 V
Local
12 bit
Shutdown
SMD/SMT
Reel
Cut Tape
MouseReel
Brand: Texas Instruments
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Product: Digital Temperature Sensors
Product Type: Board Mount Temperature Sensor ICs
Series: TMP110
Factory Pack Quantity: 3000
Subcategory: Sensors
Type: Accurate Ultra Small Sensor
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CNHTS:
8542391010
USHTS:
8542390090
TARIC:
8542399000
MXHTS:
8542399999
ECCN:
EAR99

TMP110 I2C-Compatible Digital Temperature Sensors

Texas Instruments TMP110 I2C-Compatible Digital Temperature Sensors come in an ultra-small (0.64mm2) 5-pin package. The small size and height of the package optimize volume-constrained systems, which DSBGA packages can be considered unsuitable. Unlike DSBGA packages of comparable size, the TMP110 provides a 5th pin that can be used as an address or alert pin. This feature provides flexibility for scalability of the number of sensors or monitoring critical thermal events.