conga-HPC/mRLP-HSP-B
787-049254
conga-HPC/mRLP-HSP-B
Mfr.:
Description:
Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
Availability
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Stock:
-
Non-StockedAn unexpected error occurred. Please try again later.
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Factory Lead Time:
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14 Weeks Estimated factory production time.
Pricing (IDR)
| Qty. | Unit Price |
Ext. Price
|
|---|---|---|
| Rp736.590 | Rp736.590 | |
| Rp679.134 | Rp6.791.340 | |
| Rp636.743 | Rp15.918.575 | |
| Rp598.381 | Rp29.919.050 | |
| Rp576.660 | Rp57.666.000 | |
| Rp549.333 | Rp137.333.250 | |
| 500 | Quote |
Indonesia
