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170673-2278

Name: Molex 170673-2278
Brand: Molex
SKU: 538-170673-2278
Price: 909307.47 IDR
Availability: InStock

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Mouser No:

538-170673-2278

Mfr. No:

170673-2278

Mfr.:

Molex

Description:

Standard Card Edge Connectors EDGELINE 278CKTS 0.062 PCB

Datasheet:

170673-2278 Datasheet

ECAD Model:

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More Information

Learn more about Molex 170673-2278

In Stock: 198

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp909.307,47	Rp909.307,47
	Rp773.025,21	Rp7.730.252,10
	Rp724.678,29	Rp18.116.957,25
	Rp689.994,63	Rp34.499.731,50
	Rp622.554,18	Rp62.255.418,00
	Rp616.072,89	Rp177.428.992,32

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Standard Card Edge Connectors
RoHS:
Number of Positions:	278 Position
Pitch:	0.8 mm
Mounting Style:	Press Fit
Mounting Angle:	Vertical
Contact Plating:	Gold
Series:	170673
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	1.5 A
Housing Material:	Thermoplastic (TP)
Maximum Operating Temperature:	+ 105 C
Minimum Operating Temperature:	- 40 C
Packaging:	Tray
Product Type:	Standard Card Edge Connectors
Factory Pack Quantity:	1
Subcategory:	Card Edge Connectors
Tradename:	EdgeLine
Voltage Rating:	250 VAC
Part # Aliases:	1706732278 1706732278
Unit Weight:	11,073 g

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Datasheet

170673-2278 Datasheet

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

EdgeLine Connectors

Molex EdgeLine Low-Profile Connectors support up to 25Gbps data rates and are available in multiple orientations and PCB thicknesses from 1.57mm to 3.18mm for use in high-speed transmissions and high-density signal applications. The product line's one-piece solutions are cost-effective as they are only required when a peripheral interface or upgrade card is populated. EdgeLine includes a customizable card-edge interface to enable designers to specify first-mate, last-break designations as well as shorter stubs for high-speed communications. The Molex EdgeLine family delivers a low-cost, flexible, and scalable solution for low-to-mid range telecom, computing, and storage applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.