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5557-4X10

Name: 3M 5557-4X10
Brand: 3M Electronic Specialty
SKU: 517-5557-4X10
Price: 866566 IDR
Availability: InStock

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Mouser No:

517-5557-4X10

Mfr. No:

5557-4X10

Mfr.:

3M Electronic Specialty

Description:

Adhesive Tapes Water Contact Indicator Tape White, 4 in x 10yds Roll

Datasheet:

5557-4X10 Datasheet (PDF)

More Information

Learn more about 3M Electronic Specialty 5557-4X10

In Stock: 37

Stock:: 37

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On Order:: 32
Factory Lead Time:: 11

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp866.566	Rp866.566
	Rp710.314	Rp7.103.140
	Rp647.954	Rp16.198.850
	Rp606.789	Rp30.339.450
	Rp586.119	Rp58.611.900
	Rp564.223	Rp141.055.750
500	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	3M
Product Category:	Adhesive Tapes
RoHS:
Product:	Tapes
Type:	Water Indicator
Description/Function:	Water Contact Indicator Tape. The Tape Turns from White to Red Upon Direct Water Contact
Color:	White
Material:	Polyester
Adhesive Type:	Acrylic
Width - in:	4 in
Width - mm:	101.6 mm
Length - in:	10 yd
Length - mm:	9.14 m
Brand:	3M Electronic Specialty
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	Tape
Factory Pack Quantity:	1
Subcategory:	Supplies
Thickness:	0.259 mm
Part # Aliases:	7000050152
Unit Weight:	742,172 g

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Datasheet

5557-4X10 Datasheet (PDF)

CNHTS:: 3919109900
USHTS:: 3822190080
TARIC:: 3919108090
ECCN:: EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.