FS1000R08A7P3BHPSA1

Name: Infineon FS1000R08A7P3BHPSA1
Brand: Infineon Technologies
SKU: 726-FS1000R08A7P3BHP
Price: 7867410 IDR
Availability: InStock

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Mouser No:

726-FS1000R08A7P3BHP

Mfr. No:

FS1000R08A7P3BHPSA1

Mfr.:

Infineon Technologies

Description:

MOSFET Modules HybridPACK Drive G2 module

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

FS1000R08A7P3BHPSA1 Datasheet (PDF)

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In Stock: 3

Stock:: 3 Can Dispatch Immediately

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Factory Lead Time:: 4 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp7.867.410	Rp7.867.410

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	MOSFET Modules
RoHS:
Technology:	Si
Mounting Style:	Screw Mount
Package/Case:	HybridPACK
Vgs th - Gate-Source Threshold Voltage:	6.65 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 175 C
Pd - Power Dissipation:	750 W
Packaging:	Tray
Brand:	Infineon Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	DE
Fall Time:	91 ns
Product:	Modules
Product Type:	MOSFET Modules
Rise Time:	50 ns
Factory Pack Quantity:	6
Subcategory:	Discrete and Power Modules
Typical Turn-Off Delay Time:	929 ns
Typical Turn-On Delay Time:	222 ns
Vf - Forward Voltage:	1.76 V
Vr - Reverse Voltage:	750 V
Part # Aliases:	FS1000R08A7P3B SP005913585

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Datasheet

FS1000R08A7P3BHPSA1 Datasheet (PDF)

CNHTS:: 8504409100
CAHTS:: 8541290000
USHTS:: 8541290065
JPHTS:: 854129000
TARIC:: 8541290000
MXHTS:: 8541299900
ECCN:: EAR99

HybridPACK™ Drive G2 Modules

Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.