HSB14-353518

Same Sky
490-HSB14-353518
HSB14-353518

Mfr.:

Description:
Heat Sinks heat sink, BGA, 35 x 35 x 18 mm

ECAD Model:
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In Stock: 1.059

Stock:
1.059 Can Dispatch Immediately
Factory Lead Time:
14 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
Rp-
Ext. Price:
Rp-
Est. Tariff:

Pricing (IDR)

Qty. Unit Price
Ext. Price
Rp29.954 Rp29.954
Rp26.626 Rp266.260
Rp25.400 Rp635.000
Rp24.349 Rp1.217.450
Rp23.473 Rp2.347.300
Rp21.721 Rp5.430.250
Rp21.196 Rp10.598.000
Rp20.320 Rp20.320.000
Rp18.918 Rp48.430.080

Product Attribute Attribute Value Select Attribute
Same Sky
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
Adhesive
Aluminum Alloy
Vertical Fin
12.7 C/W
35 mm
35 mm
18 mm
Brand: Same Sky
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Packaging: Box
Product Type: Heat Sinks
Factory Pack Quantity: 1280
Subcategory: Heat Sinks
Type: Component
Products found:
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Attributes selected: 0

CNHTS:
8473309000
USHTS:
8542900000
TARIC:
8542900000
ECCN:
EAR99

Heat Sinks

Same Sky Heat Sinks are are designed to dissipate heat in natural convection and forced air environments. This line of aluminum and copper heat sinks from Same Sky offers a variety of form factors and package types to meet onboard cooling needs. Fin styles include angled, formed, straight, twisted, vertical, extruded axial, and extruded radial. The heat sink lineup also features a variety of mounting styles, such as adhesive, SMT, and through-hole.

BGA Heat Sinks

Same Sky BGA Heat Sinks are ideal for ball grid array (BGA) devices and are measured under four conditions for thermal resistance. These heat sinks carry power dissipation ratings from 1.92W up to 21.74W at +75°C. Made from aluminum or copper with a black anodized or clean finish, the HSB series supports a wide range of sizes, from 8.5mm x 8.5mm to 69.7mm x 69.7mm, with 5mm to 25mm profiles. As adhesive or PCB mountable devices, Same Sky BGA Heat Sinks are essentially simple extrusions where the extruded fins have been crosscut into pins, making them suitable for BGA applications.