HSB44-606010P

Name: Same Sky HSB44-606010P
Brand: Same Sky
SKU: 179-HSB44-606010P
Price: 118590 IDR
Availability: InStock

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Mouser No:

179-HSB44-606010P

Mfr. No:

HSB44-606010P

Mfr.:

Same Sky

Description:

Heat Sinks heat sink, BGA, 60 x 60 x 10 mm, 4 push pins

Lifecycle:

New At Mouser

Datasheet:

HSB44-606010P Datasheet (PDF)

ECAD Model:

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More Information

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In Stock: 936

Stock:: 936

Can Dispatch Immediately

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On Order:: 940
Factory Lead Time:: 16

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

Rp-

Ext. Price:

Rp-

Est. Tariff:

Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp118.590	Rp118.590
	Rp105.102	Rp1.051.020
	Rp98.446	Rp2.461.150
	Rp92.840	Rp4.642.000
	Rp92.315	Rp11.077.800
	Rp85.133	Rp20.431.920
	Rp82.155	Rp49.293.000
	Rp81.980	Rp88.538.400
	Rp81.804	Rp206.146.080

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Same Sky
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	PCB
Heatsink Material:	Aluminum
Thermal Resistance:	10.6 C/W
Length:	60 mm
Width:	60 mm
Height:	10 mm
Brand:	Same Sky
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Product Type:	Heat Sinks
Factory Pack Quantity:	120
Subcategory:	Heat Sinks
Type:	BGA Heat Sink

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Datasheet

HSB44-606010P Datasheet (PDF)

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CNHTS:: 8548000090
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

BGA Heat Sinks

Same Sky BGA Heat Sinks are ideal for ball grid array (BGA) devices and are measured under four conditions for thermal resistance. These heat sinks carry power dissipation ratings from 1.92W up to 21.74W at +75°C. Made from aluminum or copper with a black anodized or clean finish, the HSB series supports a wide range of sizes, from 8.5mm x 8.5mm to 69.7mm x 69.7mm, with 5mm to 25mm profiles. As adhesive or PCB mountable devices, Same Sky BGA Heat Sinks are essentially simple extrusions where the extruded fins have been crosscut into pins, making them suitable for BGA applications.