|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-06-2-K-TR
- Samtec
-
300:
Rp212.656
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM30015S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp212.656
|
|
|
Rp182.002
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-1-K-TR
- Samtec
-
300:
Rp271.338
-
Non-Stocked Lead-Time 2 Weeks
|
Mouser Part No
200-LPAM30015S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 2 Weeks
|
|
|
Rp271.338
|
|
|
Rp232.100
|
|
|
Rp198.993
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-2-K-TR
- Samtec
-
300:
Rp271.338
-
Non-Stocked Lead-Time 2 Weeks
|
Mouser Part No
200-LPAM30015S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 2 Weeks
|
|
|
Rp271.338
|
|
|
Rp232.100
|
|
|
Rp198.993
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-40-01.0-L-04-2-K-TR
- Samtec
-
475:
Rp212.656
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM40010L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD LOW PRO
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp212.656
|
|
|
Rp182.002
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 475
Mult.: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-1-K-TR
- Samtec
-
325:
Rp252.945
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM40010L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp252.945
|
|
|
Rp216.510
|
|
|
Rp185.505
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-1-K-TR
- Samtec
-
300:
Rp322.663
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAM40010L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-06-2-K-TR
- Samtec
-
325:
Rp266.083
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM40010S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp266.083
|
|
|
Rp227.721
|
|
|
Rp195.139
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-1-K-TR
- Samtec
-
300:
Rp339.479
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
200-LPAM40010S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-1-K-TR
- Samtec
-
450:
Rp217.211
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM40015L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp217.211
|
|
|
Rp185.855
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-2-K-TR
- Samtec
-
450:
Rp217.211
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM40015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp217.211
|
|
|
Rp185.855
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-1-K-TR
- Samtec
-
300:
Rp329.495
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM40015L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-1-K-TR
- Samtec
-
450:
Rp228.071
-
Non-Stocked Lead-Time 11 Weeks
|
Mouser Part No
200-LPAM40015S041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 11 Weeks
|
|
|
Rp228.071
|
|
|
Rp167.287
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-2-K-TR
- Samtec
-
450:
Rp228.071
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM40015S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp228.071
|
|
|
Rp195.139
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-1-K-TR
- Samtec
-
300:
Rp404.993
-
Non-Stocked Lead-Time 8 Weeks
|
Mouser Part No
200-LPAM50010S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 8 Weeks
|
|
|
Rp404.993
|
|
|
Rp297.088
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-2-K-TR
- Samtec
-
300:
Rp404.993
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAM50010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp404.993
|
|
|
Rp297.088
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-S-08-2-K-TR
- Samtec
-
300:
Rp459.996
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM50015S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-2-K-TR
- Samtec
-
1:
Rp246.990
-
Non-Stocked Lead-Time 14 Weeks
|
Mouser Part No
200-LPAM10010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 14 Weeks
|
|
|
Rp246.990
|
|
|
Rp236.304
|
|
|
Rp227.371
|
|
|
Rp210.730
|
|
|
Rp153.974
|
|
|
View
|
|
|
Rp180.951
|
|
|
Rp153.974
|
|
|
Rp131.728
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-2-K-TR
- Samtec
-
300:
Rp212.656
-
Non-Stocked Lead-Time 14 Weeks
|
Mouser Part No
200-LPAM20010L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 14 Weeks
|
|
|
Rp212.656
|
|
|
Rp182.002
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
Rp223.692
-
Non-Stocked Lead-Time 14 Weeks
|
Mouser Part No
200-LPAM20010S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 14 Weeks
|
|
|
Rp223.692
|
|
|
Rp191.461
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-20-01.5-L-08-2-K-TR
- Samtec
-
1:
Rp348.413
-
Non-Stocked Lead-Time 14 Weeks
|
Mouser Part No
200-LPAM20015L082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors 1.27MM LP ARRAY HS HD LOW PRO
|
|
Non-Stocked Lead-Time 14 Weeks
|
|
|
Rp348.413
|
|
|
Rp333.173
|
|
|
Rp320.561
|
|
|
Rp297.263
|
|
|
Rp217.211
|
|
|
View
|
|
|
Rp255.223
|
|
|
Rp185.855
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-1-K-TR
- Samtec
-
325:
Rp198.468
-
Non-Stocked Lead-Time 14 Weeks
|
Mouser Part No
200-LPAM30010L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 14 Weeks
|
|
|
Rp198.468
|
|
|
Rp169.740
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-1-K-TR
- Samtec
-
1:
Rp324.940
-
Non-Stocked Lead-Time 14 Weeks
|
Mouser Part No
200-LPAM30015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 14 Weeks
|
|
|
Rp324.940
|
|
|
Rp310.752
|
|
|
Rp299.015
|
|
|
Rp277.294
|
|
|
Rp202.672
|
|
|
View
|
|
|
Rp238.056
|
|
|
Rp173.418
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-1-K-TR
- Samtec
-
300:
Rp212.656
-
Non-Stocked Lead-Time 2 Weeks
|
Mouser Part No
200-LPAM2001.0L081K
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 2 Weeks
|
|
|
Rp212.656
|
|
|
Rp182.002
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 300
Mult.: 300
:
300
|
No
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-1-K-TR
- Samtec
-
1:
Rp358.923
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM2001.0S081K
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp358.923
|
|
|
Rp343.158
|
|
|
Rp330.195
|
|
|
Rp306.022
|
|
|
Rp223.692
|
|
|
View
|
|
|
Rp262.930
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Rp191.461
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Quote
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Min.: 1
Mult.: 1
:
300
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No
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LPAM
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Reel, Cut Tape
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