|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-S-06-2-K-TR
- Samtec
-
500:
Rp168.163
-
Non-Stocked Lead-Time 11 Weeks
|
Mouser Part No
200-LPAF30035S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 11 Weeks
|
|
|
Rp168.163
|
|
|
Rp144.165
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-S-08-1-K-TR
- Samtec
-
325:
Rp250.668
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF30035S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp250.668
|
|
|
Rp214.583
|
|
|
Rp183.929
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-04-2-K-TR
- Samtec
-
550:
Rp168.338
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF40030L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp168.338
|
|
|
Rp144.340
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-06-1-K-TR
- Samtec
-
550:
Rp200.219
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF40030L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp200.219
|
|
|
Rp171.667
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-08-1-K-TR
- Samtec
-
350:
Rp298.315
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF40030L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp298.315
|
|
|
Rp218.963
|
|
Min.: 350
Mult.: 350
:
350
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-S-06-2-K-TR
- Samtec
-
550:
Rp210.029
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF40030S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp210.029
|
|
|
Rp180.075
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-04-1-K-TR
- Samtec
-
500:
Rp171.491
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF40035L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp171.491
|
|
|
Rp146.968
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-04-2-K-TR
- Samtec
-
500:
Rp171.491
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF40035L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp171.491
|
|
|
Rp146.968
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-04-2-K-TR
- Samtec
-
500:
Rp180.250
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF40035S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp180.250
|
|
|
Rp154.500
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-08-1-K-TR
- Samtec
-
325:
Rp319.685
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAF40035S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp319.685
|
|
|
Rp234.553
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-L-08-1-K-TR
- Samtec
-
350:
Rp355.945
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF50030L081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp355.945
|
|
|
Rp261.178
|
|
Min.: 350
Mult.: 350
:
350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-S-08-1-K-TR
- Samtec
-
350:
Rp373.638
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF50030S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp373.638
|
|
|
Rp274.141
|
|
Min.: 350
Mult.: 350
:
350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-S-08-2-K-TR
- Samtec
-
350:
Rp373.638
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAF50030S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp373.638
|
|
|
Rp274.141
|
|
Min.: 350
Mult.: 350
:
350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.5-S-08-1-K-TR
- Samtec
-
325:
Rp381.520
-
Non-Stocked Lead-Time 6 Weeks
|
Mouser Part No
200-LPAF50035S081KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 6 Weeks
|
|
|
Rp381.520
|
|
|
Rp279.746
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.5-S-08-2-K-TR
- Samtec
-
325:
Rp459.296
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAF50035S082KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-1-K-TR
- Samtec
-
625:
Rp101.423
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp101.423
|
|
|
Rp86.884
|
|
Min.: 625
Mult.: 625
:
625
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-06-1-K-TR
- Samtec
-
400:
Rp141.888
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp141.888
|
|
|
Rp120.692
|
|
|
Rp88.636
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-06-2-K-TR
- Samtec
-
400:
Rp141.888
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp141.888
|
|
|
Rp120.692
|
|
|
Rp88.636
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-04-2-K-TR
- Samtec
-
625:
Rp106.854
-
Non-Stocked Lead-Time 3 Weeks
|
Mouser Part No
200-LPAM10010S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 3 Weeks
|
|
|
Rp106.854
|
|
|
Rp91.439
|
|
Min.: 625
Mult.: 625
:
625
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-2-K-TR
- Samtec
-
400:
Rp149.245
-
Non-Stocked Lead-Time 4 Weeks
|
Mouser Part No
200-LPAM10010S062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 4 Weeks
|
|
|
Rp149.245
|
|
|
Rp126.998
|
|
|
Rp93.190
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-1-K-TR
- Samtec
-
575:
Rp103.701
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM10015L041KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp103.701
|
|
|
Rp88.636
|
|
Min.: 575
Mult.: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-2-K-TR
- Samtec
-
575:
Rp103.701
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM10015L042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp103.701
|
|
|
Rp88.636
|
|
Min.: 575
Mult.: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-1-K-TR
- Samtec
-
375:
Rp144.866
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAM10015L061KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp144.866
|
|
|
Rp123.320
|
|
|
Rp105.452
|
|
Min.: 375
Mult.: 375
:
375
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-2-K-TR
- Samtec
-
375:
Rp144.866
-
Non-Stocked Lead-Time 5 Weeks
|
Mouser Part No
200-LPAM10015L062KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 5 Weeks
|
|
|
Rp144.866
|
|
|
Rp123.320
|
|
|
Rp105.452
|
|
Min.: 375
Mult.: 375
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-04-2-K-TR
- Samtec
-
575:
Rp108.781
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
200-LPAM10015S042KTR
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp108.781
|
|
|
Rp93.190
|
|
Min.: 575
Mult.: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|