Ka-Ro electronics Computer-On-Modules - COM

Results: 49
Select Image Part # Mfr. Description Datasheet Availability Pricing (IDR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Form Factor Processor Brand Processor Type Chipsets Frequency Maximum RAM Capacity Installed RAM Cache Memory Operating Supply Voltage Interface Type Minimum Operating Temperature Maximum Operating Temperature Dimensions
Ka-Ro electronics Computer-On-Modules - COM Freescale iMX6 Dual COM SO-DIMM
Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1

SO-DIMM Freescale i.MX 6U7 800 MHz 1 GB 0 GB 1 MB 3.1 V to 5.5 V - 40 C + 85 C 68 mm x 31 mm x 4 mm
Ka-Ro electronics Computer-On-Modules - COM Freescale iMX6 Dual COM SO-DIMM EXT TEMP
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

SO-DIMM Freescale i.MX 6U7 800 MHz 1 GB 0 GB 1 MB 3.1 V to 5.5 V - 25 C + 85 C 68 mm x 31 mm x 4 mm
Ka-Ro electronics Computer-On-Modules - COM Non-Stocked Lead-Time 7 Weeks
Min.: 1
Mult.: 1

RZ/G2L 1.2 GHz, 200 MHz, 500 MHz 1 GB 1 GB 32 kB, 256 kB 3.3 V to 5 V Ethernet, I2C, MIPI CSI, SAI, SPI, UART, USB - 40 C + 85 C 67.6 mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Modules - COM Non-Stocked Lead-Time 4 Weeks
Min.: 1
Mult.: 1

RZ/G2L 1.2 GHz, 200 MHz, 500 MHz 1 GB 1 GB 32 kB, 256 kB 3.3 V to 5 V Ethernet, I2C, MIPI CSI, SAI, SPI, UART, USB - 40 C + 85 C 67.6 mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Modules - COM QS8M/MQ/1600/1024S/4GF/E85 socketed module Non-Stocked
Min.: 1
Mult.: 1

NXP i.MX 8M Mini 400 MHz, 1.6 GHz 1 GB 1 GB 32 kB, 512 kB 3.3 V Ethernet, I2C, MIPI CSI, SAI, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Modules - COM QS8M/ND/1400/512S/4GF/E85 Non-Stocked
Min.: 10
Mult.: 10

NXP i.MX 8M Nano 600 MHz, 1.4 GHz 512 MB 512 MB 32 kB, 512 kB 3.3 V Ethernet, I2C, MIPI CSI, SAI, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Modules - COM QS8M/ND/1400/512S/4GF/E85 socketed module Non-Stocked
Min.: 1
Mult.: 1

NXP i.MX 8M Nano 600 MHz, 1.4 GHz 512 MB 512 MB 32 kB, 512 kB 3.3 V Ethernet, I2C, MIPI CSI, SAI, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Modules - COM QSMP/151A/256S/128F/I Non-Stocked
Min.: 1
Mult.: 1

STMicroelectronics STM32MP151A 200 MHz, 650 MHz 256 MB 256 MB 32 kB, 256 kB Ethernet, I2C, SAI, SPI, UART, USB - 40 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Modules - COM QFN Style Solder-Down Computer On Module -COM QSMP/157C/256S/4GF/E85 Non-Stocked
Min.: 1
Mult.: 1

ARM ARM Cortex-A7, ARM Cortex-M4 209 MHz, 650 MHz 3.3 V LVDS, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Modules - COM QSMP/157C/512S/4GF/E85 socketed module Non-Stocked
Min.: 1
Mult.: 1

STM32MP1 650 MHz, 200 MHz 512 MB 512 MB 32 kB, 256 kB 3.3 V Ethernet, I2C, SAI, SPI, UART, USB - 25 C + 85 C 27 mm x 27 mm x 2.3 mm
Ka-Ro electronics Computer-On-Modules - COM QFN Style Solder-Down Computer On Module -COM QSMP23/235C/1GS/4GF/I Non-Stocked
Min.: 1
Mult.: 1

ARM ARM Cortex-A35, ARM Cortex-M33 400 MHz 3.3 V LVDS, USB - 40 C + 85 C 27 mm x 27 mm x 2.6 mm
Ka-Ro electronics Computer-On-Modules - COM socketed version of QSMP-2350, needs additional QSBASE5 to run Non-Stocked
Min.: 1
Mult.: 1

ARM ARM Cortex-A35, ARM Cortex-M33 400 MHz 3.3 V LVDS, USB - 40 C + 85 C 27 mm x 27 mm x 2.6 mm
Ka-Ro electronics Computer-On-Modules - COM QFN type lead style has a 1mm pitch with 100 pads. The ground pad additionally acts as thermal pad. Non-Stocked
Min.: 1
Mult.: 1

Renesas RZ/G2L 1.2 GHz 1 GB 3.1 V to 3.6 V - 40 C + 85 C
Ka-Ro electronics Computer-On-Modules - COM Socketed version of the QSRZ-G2L0 for use on the QSBASE4 QS-Evalkit. Non-Stocked
Min.: 1
Mult.: 1

Renesas RZ/G2L 1.2 GHz 1 GB 3.1 V to 3.6 V I2C - 40 C + 85 C
Ka-Ro electronics Computer-On-Modules - COM QFN Style Solder-Down Computer On Module. Small square size module of 27mm, height of 2.7mm, single-sided assembled. QFN type lead style has a 1mm pitch with 100 pads. Ground pad also acts as thermal pad. Non-Stocked
Min.: 1
Mult.: 1

Renesas RZ/G2L 1.2 GHz 512 MB 3.1 V to 3.6 V - 40 C + 85 C
Ka-Ro electronics Computer-On-Modules - COM Freescale iMX283 COM SO-DIMM COMM TEMP
N/A
Min.: 1
Mult.: 1

SO-DIMM Freescale i.MX283 454 MHz 64 MB 3.1 V to 5.5 V I2C, SPI, UART 0 C + 70 C 67.6 mm x 26 mm x 3.6 mm
Ka-Ro electronics Computer-On-Modules - COM Freescale iMX6 Quad COM SO-DIMM
N/A
Min.: 1
Mult.: 1

SO-DIMM Freescale i.MX 6Quad 1 GHz 1 GB 0 GB 1 MB 3.1 V to 5.5 V - 20 C + 70 C 67.6 mm x 31 mm x 3.6 mm
Ka-Ro electronics Computer-On-Modules - COM i.MX6 Dual COM SO-DIMM LVDS Ind
Non-Stocked
Min.: 1
Mult.: 1
SO-DIMM NXP i.MX 6DualLite 800 MHz 1 GB 0 GB 512 kB 3.1 V to 5.5 V - 25 C + 85 C 31 mm x 68 mm x 4 mm
Ka-Ro electronics Computer-On-Modules - COM N/A
Min.: 1
Mult.: 1
NXP i.MX 8M Mini Quad 1.6 GHz 2 GB 3.3 V to 5 V Ethernet, MIPI CSI, PCIe, UART, USB - 25 C + 85 C 68 mm x 28 mm x 4 mm
Ka-Ro electronics Computer-On-Modules - COM Non-Stocked
Min.: 1
Mult.: 1

SO-DIMM NXP i.MX 8M Plus 1.6 GHz 2 GB 512 kB 3.3 V to 5 V CSI, Ethernet, HDMI, I2C, MIPI, PCle, SPI, UART, USB - 30 C + 85 C 67.6 mm x 26 mm x 4 mm
Ka-Ro electronics Computer-On-Modules - COM Computer-On-Modules - COM TXMP/157C512S/4GF/E85/SDOK Non-Stocked
Min.: 1
Mult.: 1

ARM ARM Cortex-A7, ARM Cortex-M4 209 MHz, 650 MHz 3.3 V I2C, SPI, UART - 25 C + 85 C
Ka-Ro electronics Computer-On-Modules - COM Computer-On-Modules - COM TXMP2/257C/1GS/4GF/I Non-Stocked
Min.: 1
Mult.: 1

ARM ARM Cortex-A35 1.5 GHz - 40 C + 85 C 68 mm x 26 mm x 4 mm
Ka-Ro electronics TX6S-8134
Ka-Ro electronics Computer-On-Modules - COM iMX6 Solo COM SO-DIMM LVDS Ind
Non-Stocked
Min.: 1
Mult.: 1
Ka-Ro electronics TX6S-8135
Ka-Ro electronics Computer-On-Modules - COM iMX6 Solo COM SO-DIMM LVDS Ext
Non-Stocked
Min.: 1
Mult.: 1