|
|
eMMC
- AF032GEC5X-2006IX
- ATP Electronics
-
1.050:
Rp286.578,12
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-AF032GEC5X2006IX
New Product
|
ATP Electronics
|
eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 1.050
Mult.: 1.050
|
|
|
|
BGA-153
|
32 GB
|
TLC
|
|
|
eMMC 5.1
|
|
|
- 40 C
|
+ 85 C
|
|
|
|
|
eMMC
- AF064GEC5X-2004CX
- ATP Electronics
-
760:
Rp426.889,29
-
Non-Stocked Lead-Time 29 Weeks
|
Mouser Part No
162-AF064GEC5X2004CX
|
ATP Electronics
|
eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
64 GB
|
3D TLC
|
270 MB/s
|
215 MB/s
|
eMMC 5.1 HS400
|
2.7 V
|
3.6 V
|
- 25 C
|
+ 85 C
|
|
|
|
|
eMMC
- AF064GEC5X-2004IX
- ATP Electronics
-
760:
Rp433.020,24
-
Non-Stocked Lead-Time 29 Weeks
|
Mouser Part No
162-AF064GEC5X2004IX
|
ATP Electronics
|
eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
64 GB
|
3D TLC
|
270 MB/s
|
215 MB/s
|
eMMC 5.1 HS400
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
|
|
|
|
eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
- AF064GEC5X-2006CX
- ATP Electronics
-
1.050:
Rp675.280,35
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-AF064GEC5X2006CX
New Product
|
ATP Electronics
|
eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 1.050
Mult.: 1.050
|
|
|
|
BGA-153
|
64 GB
|
TLC
|
290 MB/s
|
225 MB/s
|
eMMC 5.1
|
|
|
- 25 C
|
+ 85 C
|
|
|
|
|
eMMC Industrial Temp. -40C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
- AF064GEC5X-2006IX
- ATP Electronics
-
1.050:
Rp689.469,12
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-AF064GEC5X2006IX
New Product
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 1.050
Mult.: 1.050
|
|
|
|
BGA-153
|
64 GB
|
TLC
|
|
|
eMMC 5.1
|
|
|
- 40 C
|
+ 85 C
|
|
|
|
|
eMMC
- AF128GEC5X-2002CX
- ATP Electronics
-
760:
Rp809.110,23
-
Non-Stocked Lead-Time 29 Weeks
|
Mouser Part No
162-AF128GEC5X2002CX
|
ATP Electronics
|
eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
E600Vc
|
FBGA-153
|
|
|
|
|
|
|
|
|
|
|
|
|
|
eMMC Industrial Temp. -40C to +85C 11.5x13 TLC eMMC
- AF128GEC5X-2002IX
- ATP Electronics
-
760:
Rp1.318.154,25
-
Non-Stocked Lead-Time 40 Weeks
|
Mouser Part No
162-AF128GEC5X2002IX
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 11.5x13 TLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
E600Si
|
FBGA-153
|
|
|
|
|
|
|
|
|
|
|
|
|
|
eMMC Commercial Temp. -25C to +85C 11.5x13 pSLC eMMC
- FA4G00EMCV3RBFC
- ATP Electronics
-
760:
Rp143.814,57
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-FA4G00EMCV3RBFC
New Product
|
ATP Electronics
|
eMMC Commercial Temp. -25C to +85C 11.5x13 pSLC eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
E700Pc
|
FBGA-153
|
|
PSLC
|
|
|
|
|
|
- 25 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC Industrial Temp. -40C to +85C 11.5x13 pSLC eMMC
- FA4G00EMCV3RBFI
- ATP Electronics
-
1:
Rp226.144,47
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-FA4G00EMCV3RBFI
New Product
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 11.5x13 pSLC eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
|
Rp226.144,47
|
|
|
Rp210.028,83
|
|
|
Rp203.722,71
|
|
|
Rp198.817,95
|
|
|
View
|
|
|
Rp193.913,19
|
|
|
Rp187.607,07
|
|
|
Rp178.147,89
|
|
Min.: 1
Mult.: 1
|
|
|
E700Pi
|
FBGA-153
|
|
PSLC
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC Commercial Temp. -25C to +85C 11.5x13 pSLC eMMC
- FA8G00EMCV3RBFC
- ATP Electronics
-
760:
Rp206.875,77
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-FA8G00EMCV3RBFC
New Product
|
ATP Electronics
|
eMMC Commercial Temp. -25C to +85C 11.5x13 pSLC eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
E700Pc
|
FBGA-153
|
|
PSLC
|
|
|
|
|
|
- 25 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC Industrial Temp. -40C to +85C 11.5x13 pSLC eMMC
- FA8G00EMCV3RBFI
- ATP Electronics
-
760:
Rp240.508,41
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-FA8G00EMCV3RBFI
New Product
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 11.5x13 pSLC eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
E700Pi
|
FBGA-153
|
|
PSLC
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC Commercial Temp. -25C to +85C 11.5x13 MLC eMMC
- FM16G0EMCV3RBFC
- ATP Electronics
-
760:
Rp474.185,19
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-FM16G0EMCV3RBFC
New Product
|
ATP Electronics
|
eMMC Commercial Temp. -25C to +85C 11.5x13 MLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
E600Sc
|
FBGA-153
|
16 GB
|
MLC
|
230 MB/s
|
100 MB/s
|
eMMC 5.1
|
|
|
- 25 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC Industrial Temp. -40C to +85C 11.5x13 MLC eMMC
- FM16G0EMCV3RBFI
- ATP Electronics
-
760:
Rp533.918,16
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-FM16G0EMCV3RBFI
New Product
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 11.5x13 MLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
E600Si
|
FBGA-153
|
16 GB
|
MLC
|
230 MB/s
|
100 MB/s
|
eMMC 5.1
|
|
|
- 40 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC Commercial Temp. -25C to +85C 11.5x13 MLC eMMC
- FM8G00EMCV3RBFC
- ATP Electronics
-
1:
Rp346.311,09
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-FM8G00EMCV3RBFC
New Product
|
ATP Electronics
|
eMMC Commercial Temp. -25C to +85C 11.5x13 MLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
|
Rp346.311,09
|
|
|
Rp321.261,78
|
|
|
Rp311.277,09
|
|
|
Rp303.744,78
|
|
|
View
|
|
|
Rp296.212,47
|
|
|
Rp286.578,12
|
|
|
Rp273.440,37
|
|
Min.: 1
Mult.: 1
|
|
|
E600Sc
|
FBGA-153
|
|
MLC
|
|
|
|
|
|
- 25 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC Industrial Temp. -40C to +85C 11.5x13 MLC eMMC
- FM8G00EMCV3RBFI
- ATP Electronics
-
1:
Rp394.658,01
-
Non-Stocked Lead-Time 40 Weeks
-
New Product
|
Mouser Part No
162-FM8G00EMCV3RBFI
New Product
|
ATP Electronics
|
eMMC Industrial Temp. -40C to +85C 11.5x13 MLC eMMC
|
|
Non-Stocked Lead-Time 40 Weeks
|
|
|
Rp394.658,01
|
|
|
Rp365.754,96
|
|
|
Rp354.018,57
|
|
|
Rp345.435,24
|
|
|
View
|
|
|
Rp336.851,91
|
|
|
Rp325.641,03
|
|
|
Rp313.904,64
|
|
Min.: 1
Mult.: 1
|
|
|
E600Si
|
FBGA-153
|
|
MLC
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
Tray
|
|
|
|
eMMC eMMC 128GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
- ASFC128G32T5-51BINTR
- Alliance Memory
-
1.500:
Rp4.121.750,10
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
913-C128G32T551BINTR
|
Alliance Memory
|
eMMC eMMC 128GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.500
Mult.: 1.500
|
|
|
|
FBGA-153
|
128 GB
|
TLC
|
320 MB/s
|
235 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Reel
|
|
|
|
eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
- ASFC32G31T3-51BINTR
- Alliance Memory
-
1.500:
Rp1.800.572,43
-
Non-Stocked Lead-Time 30 Weeks
|
Mouser Part No
913-FC32G31T351BINTR
|
Alliance Memory
|
eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
|
|
Non-Stocked Lead-Time 30 Weeks
|
|
Min.: 1.500
Mult.: 1.500
|
|
|
|
FBGA-153
|
32 GB
|
TLC
|
270 MB/s
|
120 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Reel
|
|
|
|
eMMC eMMC 64GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
- ASFC64G31T5-51BINTR
- Alliance Memory
-
1.500:
Rp2.223.958,32
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
913-FC64G31T551BINTR
|
Alliance Memory
|
eMMC eMMC 64GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.500
Mult.: 1.500
|
|
|
|
FBGA-153
|
64 GB
|
TLC
|
301 MB/s
|
222 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Reel
|
|
|
|
eMMC 10GB, pSLC eMMC 5.1, 3V, Gen3 TLC NAND, Industrial Grade, 153ball FBGA Package 11.5x13mm) T&R
Alliance Memory ASFC10G31P3-51BINTR
- ASFC10G31P3-51BINTR
- Alliance Memory
-
1.500:
Rp548.457,27
-
Non-Stocked Lead-Time 12 Weeks
-
New Product
|
Mouser Part No
913-FC10G31P351BINTR
New Product
|
Alliance Memory
|
eMMC 10GB, pSLC eMMC 5.1, 3V, Gen3 TLC NAND, Industrial Grade, 153ball FBGA Package 11.5x13mm) T&R
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 1.500
Mult.: 1.500
|
|
|
|
FBGA-153
|
10 GB
|
3D TLC
|
280 MB/s
|
120 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Reel
|
|
|
|
eMMC 5GB, pSLC eMMC 5.1, 3V, Gen3 TLC NAND, Industrial Grade, 153ball FBGA Package 11.5x13mm) T&R
Alliance Memory ASFC5G31P3-51BINTR
- ASFC5G31P3-51BINTR
- Alliance Memory
-
1.500:
Rp425.838,27
-
Non-Stocked Lead-Time 12 Weeks
-
New Product
|
Mouser Part No
913-SFC5G31P351BINTR
New Product
|
Alliance Memory
|
eMMC 5GB, pSLC eMMC 5.1, 3V, Gen3 TLC NAND, Industrial Grade, 153ball FBGA Package 11.5x13mm) T&R
|
|
Non-Stocked Lead-Time 12 Weeks
|
|
Min.: 1.500
Mult.: 1.500
|
|
|
|
FBGA-153
|
5 GB
|
3D TLC
|
270 MB/s
|
120 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Reel
|
|
|
|
eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC
ATP Electronics FA4G00EMCV3RBFE
- FA4G00EMCV3RBFE
- ATP Electronics
-
760:
Rp200.394,48
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-FA4G00EMCV3RBFE
New Product
|
ATP Electronics
|
eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
|
|
|
|
|
|
|
|
|
|
|
|
|
eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC
ATP Electronics FA8G00EMCV3RBFE
- FA8G00EMCV3RBFE
- ATP Electronics
-
760:
Rp268.710,78
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-FA8G00EMCV3RBFE
New Product
|
ATP Electronics
|
eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
|
|
|
|
|
|
|
|
|
|
|
|
|
eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC
ATP Electronics FM16G0EMCV3RBFE
- FM16G0EMCV3RBFE
- ATP Electronics
-
760:
Rp268.710,78
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-FM16G0EMCV3RBFE
New Product
|
ATP Electronics
|
eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
|
|
|
|
|
|
|
|
|
|
|
|
|
eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC
ATP Electronics FM8G00EMCV3RBFE
- FM8G00EMCV3RBFE
- ATP Electronics
-
760:
Rp200.394,48
-
Non-Stocked Lead-Time 29 Weeks
-
New Product
|
Mouser Part No
162-FM8G00EMCV3RBFE
New Product
|
ATP Electronics
|
eMMC Extended I-Temp. -40C to +105C 11.5x13 MLC eMMC
|
|
Non-Stocked Lead-Time 29 Weeks
|
|
Min.: 760
Mult.: 760
|
|
|
|
FBGA-153
|
|
|
|
|
|
|
|
|
|
|
|
|
|
eMMC 10GB, pSLC eMMC 5.1, 3V, Gen3 TLC NAND, Industrial Grade, 153ball FBGA Package 11.5x13mm)
Alliance Memory ASFC10G31P3-51BIN
- ASFC10G31P3-51BIN
- Alliance Memory
-
1:
Rp1.247.560,74
-
Lead-Time 30 Weeks
-
New Product
|
Mouser Part No
913-ASFC10G31P351BIN
New Product
|
Alliance Memory
|
eMMC 10GB, pSLC eMMC 5.1, 3V, Gen3 TLC NAND, Industrial Grade, 153ball FBGA Package 11.5x13mm)
|
|
Lead-Time 30 Weeks
|
|
|
Rp1.247.560,74
|
|
|
Rp1.152.268,26
|
|
|
Rp1.114.781,88
|
|
|
Rp1.086.929,85
|
|
|
Rp1.059.428,16
|
|
Min.: 1
Mult.: 1
|
|
|
|
FBGA-153
|
10 GB
|
3D TLC
|
280 MB/s
|
120 MB/s
|
eMMC 5.1
|
2.7 V
|
3.6 V
|
- 40 C
|
+ 85 C
|
Tray
|
|