|
|
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOsin FCGQFN24 and 0.4mm ball pitch package
- DA14531-00000FX2
- Renesas / Dialog
-
1:
Rp38.713
-
15.754In Stock
|
Mouser Part No
724-DA14531-00000FX2
|
Renesas / Dialog
|
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOsin FCGQFN24 and 0.4mm ball pitch package
|
|
15.754In Stock
|
|
|
Rp38.713
|
|
|
Rp33.457
|
|
|
Rp31.531
|
|
|
Rp29.078
|
|
|
View
|
|
|
Rp19.619
|
|
|
Rp27.502
|
|
|
Rp25.750
|
|
|
Rp21.371
|
|
|
Rp20.145
|
|
|
Rp19.619
|
|
Min.: 1
Mult.: 1
:
4.000
|
|
|
Bluetooth
|
ARM Cortex M0+
|
2.4 GHz
|
|
2.5 dBm
|
- 94 dBm
|
1.1 V
|
3.3 V
|
2.2 mA
|
3.5 mA
|
32 kB, 144 kB
|
- 40 C
|
+ 85 C
|
FCGQFN-24
|
Reel, Cut Tape, MouseReel
|
|
|
|
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOsin WL-CSP17 and 0.5mm ball pitch package
- DA14531-00000OG2
- Renesas / Dialog
-
1:
Rp35.735
-
5.790In Stock
|
Mouser Part No
724-DA14531-00000OG2
|
Renesas / Dialog
|
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOsin WL-CSP17 and 0.5mm ball pitch package
|
|
5.790In Stock
|
|
|
Rp35.735
|
|
|
Rp30.830
|
|
|
Rp29.253
|
|
|
Rp26.801
|
|
|
View
|
|
|
Rp19.619
|
|
|
Rp25.400
|
|
|
Rp23.998
|
|
|
Rp21.546
|
|
|
Rp20.845
|
|
|
Rp19.619
|
|
Min.: 1
Mult.: 1
:
4.000
|
|
|
Bluetooth
|
ARM Cortex M0+
|
2.4 GHz
|
|
2.5 dBm
|
- 94 dBm
|
1.1 V
|
3.3 V
|
2.2 mA
|
3.5 mA
|
32 kB, 144 kB
|
- 40 C
|
+ 85 C
|
WLCSP-17
|
Reel, Cut Tape
|
|
|
|
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
Renesas / Dialog DA14531-01000FX2
- DA14531-01000FX2
- Renesas / Dialog
-
1:
Rp34.684
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
968-DA14531-01000FX2
|
Renesas / Dialog
|
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
|
Rp34.684
|
|
|
Rp29.253
|
|
|
Rp27.151
|
|
|
Rp24.349
|
|
|
View
|
|
|
Rp19.269
|
|
|
Rp22.772
|
|
|
Rp21.721
|
|
|
Rp20.845
|
|
|
Rp20.495
|
|
|
Rp19.269
|
|
Min.: 1
Mult.: 1
:
4.000
|
|
|
Bluetooth 5.1
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
2.5 dBm
|
- 94 dBm
|
1.8 V
|
3.6 V
|
2.2 mA
|
3.5 mA
|
32 kB
|
- 40 C
|
+ 85 C
|
FCGQFN-24
|
Reel, Cut Tape
|
|
|
|
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package
Renesas / Dialog DA14531-01000OG2
- DA14531-01000OG2
- Renesas / Dialog
-
4.000:
Rp17.867
-
Non-Stocked Lead-Time 18 Weeks
|
Mouser Part No
968-DA14531-01000OG2
|
Renesas / Dialog
|
RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package
|
|
Non-Stocked Lead-Time 18 Weeks
|
|
Min.: 4.000
Mult.: 4.000
:
4.000
|
|
|
Bluetooth 5.1
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
2.5 dBm
|
- 94 dBm
|
1.8 V
|
3.6 V
|
2.2 mA
|
3.5 mA
|
32 kB
|
- 40 C
|
+ 85 C
|
WLCSP-17
|
Reel
|
|