|
|
RF System on a Chip - SoC High Performance and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE 5.0 with Built-in NFC option
- K32W061Y
- NXP Semiconductors
-
4.000:
Rp75.673,44
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-K32W061Y
|
NXP Semiconductors
|
RF System on a Chip - SoC High Performance and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE 5.0 with Built-in NFC option
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 4.000
Mult.: 4.000
|
|
|
BLE 5.0, Zigbee ,Thread
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
RF System on a Chip - SoC Secure and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE
- K32W1480VFTBR
- NXP Semiconductors
-
2.000:
Rp89.336,70
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-K32W1480VFTBR
|
NXP Semiconductors
|
RF System on a Chip - SoC Secure and Ultra-Low-Power MCU for Zigbee ,Thread, and Bluetooth LE
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
Bluetooth
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD3CVP08SC
- NXP Semiconductors
-
1:
Rp409.547,46
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD3CVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp409.547,46
|
|
|
Rp328.969,26
|
|
|
Rp310.576,41
|
|
|
Rp283.950,57
|
|
|
View
|
|
|
Rp252.419,97
|
|
|
Rp243.486,30
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 105 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD3DVK08SC
- NXP Semiconductors
-
1.200:
Rp203.022,03
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD3DVK08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.200
Mult.: 1.200
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD3DVP08SC
- NXP Semiconductors
-
630:
Rp276.768,60
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD3DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD5DVP08SC
- NXP Semiconductors
-
630:
Rp227.896,17
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD5DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD7DVK08SC
- NXP Semiconductors
-
1.200:
Rp232.800,93
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD7DVK08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.200
Mult.: 1.200
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8UD7DVP08SC
- NXP Semiconductors
-
1:
Rp365.404,62
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8UD7DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp365.404,62
|
|
|
Rp291.658,05
|
|
|
Rp273.265,20
|
|
|
Rp252.945,48
|
|
|
View
|
|
|
Rp243.311,13
|
|
|
Rp235.778,82
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US3CVP08SC
- NXP Semiconductors
-
630:
Rp207.226,11
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US3CVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 105 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US3DVK08SC
- NXP Semiconductors
-
1.200:
Rp187.081,56
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US3DVK08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.200
Mult.: 1.200
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US3DVP08SC
- NXP Semiconductors
-
630:
Rp214.758,42
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US3DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US5CVP08SC
- NXP Semiconductors
-
630:
Rp237.880,86
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US5CVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 105 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US5DVK08SC
- NXP Semiconductors
-
1.200:
Rp214.758,42
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US5DVK08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 1.200
Mult.: 1.200
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
- MIMX8US5DVP08SC
- NXP Semiconductors
-
630:
Rp216.685,29
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MIMX8US5DVP08SC
|
NXP Semiconductors
|
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 630
Mult.: 630
|
|
|
SOC
|
ARM Cortex A35
|
800 MHz
|
|
|
|
|
|
|
|
|
- 40 C
|
+ 85 C
|
|
Tray
|
|
|
|
RF System on a Chip - SoC BLE Only KW40_512
- MKW31Z512VHT4R
- NXP Semiconductors
-
1:
Rp165.710,82
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW31Z512VHT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC BLE Only KW40_512
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp165.710,82
|
|
|
Rp124.195,53
|
|
|
Rp118.414,92
|
|
|
Rp102.824,79
|
|
|
View
|
|
|
Rp81.103,71
|
|
|
Rp98.270,37
|
|
|
Rp85.132,62
|
|
|
Rp83.556,09
|
|
|
Rp81.103,71
|
|
Min.: 1
Mult.: 1
|
|
|
BLE 4.2 Wireless Radio
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
900 mV
|
4.2 V
|
6.8 mA
|
6.1 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
QFN-48
|
Reel, Cut Tape
|
|
|
|
RF System on a Chip - SoC Kinetis W MCU, ARM CM0+
- MKW34A512VFT4
- NXP Semiconductors
-
1:
Rp192.161,49
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW34A512VFT4
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W MCU, ARM CM0+
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp192.161,49
|
|
|
Rp148.544,16
|
|
|
Rp141.712,53
|
|
|
Rp122.969,34
|
|
|
View
|
|
|
Rp103.875,81
|
|
|
Rp100.547,58
|
|
|
Rp98.620,71
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
|
|
|
|
|
|
|
|
|
|
512 kB
|
|
|
|
Tray
|
|
|
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
- MKW35A512VFP4
- NXP Semiconductors
-
1:
Rp162.032,25
-
Lead-Time 16 Weeks
|
Mouser Part No
771-MKW35A512VFP4
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
|
|
Lead-Time 16 Weeks
|
|
|
Rp162.032,25
|
|
|
Rp125.947,23
|
|
|
Rp117.013,56
|
|
|
Rp107.028,87
|
|
|
View
|
|
|
Rp99.496,56
|
|
|
Rp96.343,50
|
|
|
Rp94.241,46
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
BLE
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
QFN-40
|
Tray
|
|
|
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
- MKW35A512VFP4R
- NXP Semiconductors
-
2.000:
Rp94.942,14
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW35A512VFP4R
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
BLE
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
QFN-40
|
Reel
|
|
|
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
- MKW36A512VFP4R
- NXP Semiconductors
-
2.000:
Rp96.693,84
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW36A512VFP4R
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
BLE
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
QFN-40
|
Reel
|
|
|
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
- MKW36A512VHT4R
- NXP Semiconductors
-
2.000:
Rp98.971,05
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW36A512VHT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
BLE
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
3.5 dBm
|
- 95 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
LQFN-48
|
Reel
|
|
|
|
RF System on a Chip - SoC KW37, 48HVQFN
- MKW37A512VFT4R
- NXP Semiconductors
-
2.000:
Rp96.869,01
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW37A512VFT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC KW37, 48HVQFN
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
Bluetooth 5.0
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
RF System on a Chip - SoC KW38, 48HVQFN
- MKW38A512VFT4
- NXP Semiconductors
-
1:
Rp171.841,77
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW38A512VFT4
|
NXP Semiconductors
|
RF System on a Chip - SoC KW38, 48HVQFN
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
|
Rp171.841,77
|
|
|
Rp133.829,88
|
|
|
Rp124.370,70
|
|
|
Rp113.860,50
|
|
|
View
|
|
|
Rp108.605,40
|
|
|
Rp105.452,34
|
|
|
Rp101.773,77
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
Bluetooth 5.0
|
ARM Cortex M0+
|
2.4 GHz
|
2 Mbps
|
5 dBm
|
- 95.5 dBm
|
1.71 V
|
3.6 V
|
6.3 mA
|
5.7 mA
|
512 kB
|
- 40 C
|
+ 105 C
|
HVQFN-48
|
Tray
|
|
|
|
RF System on a Chip - SoC KW38, 48HVQFN
- MKW38A512VFT4R
- NXP Semiconductors
-
2.000:
Rp99.846,90
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW38A512VFT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC KW38, 48HVQFN
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
Bluetooth 5.0
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
RF System on a Chip - SoC KW39, 48HVQFN
- MKW39A512VFT4R
- NXP Semiconductors
-
2.000:
Rp97.920,03
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-MKW39A512VFT4R
|
NXP Semiconductors
|
RF System on a Chip - SoC KW39, 48HVQFN
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.000
Mult.: 2.000
|
|
|
Bluetooth 5.0
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reel
|
|
|
|
RF System on a Chip - SoC QN9030HN/001
- QN9030HN/001K
- NXP Semiconductors
-
2.450:
Rp45.018,69
-
Non-Stocked Lead-Time 16 Weeks
|
Mouser Part No
771-QN9030HN/001K
|
NXP Semiconductors
|
RF System on a Chip - SoC QN9030HN/001
|
|
Non-Stocked Lead-Time 16 Weeks
|
|
Min.: 2.450
Mult.: 2.450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Tray
|
|
Indonesia