|
|
Thermal Interface Products Tputty 502 40 FG2 9x9" 3W/mK XSoft
- A10233-30
- Laird Technologies
-
1:
Rp2.224.659
-
19In Stock
-
16On Order
|
Mouser Part No
739-A10233-30
|
Laird Technologies
|
Thermal Interface Products Tputty 502 40 FG2 9x9" 3W/mK XSoft
|
|
19In Stock
16On Order
|
|
|
Rp2.224.659
|
|
|
Rp1.976.793
|
|
|
Rp1.971.538
|
|
|
Rp1.971.188
|
|
|
View
|
|
|
Rp1.970.838
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
Boron Nitride
|
3 W/m-K
|
4 kVAC
|
White
|
- 45 C
|
+ 200 C
|
229 mm
|
229 mm
|
0.04 in
|
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 60 FG2 9x9" 3W/mK XSoft
- A10235-31
- Laird Technologies
-
1:
Rp3.051.461
-
22In Stock
|
Mouser Part No
739-A10235-31
|
Laird Technologies
|
Thermal Interface Products Tputty 502 60 FG2 9x9" 3W/mK XSoft
|
|
22In Stock
|
|
Min.: 1
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
Thermal Pad
|
Boron Nitride
|
3 W/m-K
|
5 kVAC
|
White
|
- 45 C
|
+ 200 C
|
229 mm
|
|
1.52 mm
|
10 psi
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products T PUTTY 502 SILICONE CN02572-8 100CC
- A10548-5
- Laird Technologies
-
1:
Rp2.755.424
-
7In Stock
|
Mouser Part No
739-A10548-5
|
Laird Technologies
|
Thermal Interface Products T PUTTY 502 SILICONE CN02572-8 100CC
|
|
7In Stock
|
|
|
Rp2.755.424
|
|
|
Rp2.503.880
|
|
|
Rp2.321.528
|
|
|
Rp2.237.271
|
|
Min.: 1
Mult.: 1
|
|
|
Thermally Conductive Adhesives
|
Thermal Pad
|
Boron Nitride
|
3 W/m-K
|
|
White
|
- 45 C
|
+ 200 C
|
|
|
|
10 psi
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 80 FG2 9x9" 3W/mK XSoft
- A10237-21
- Laird Technologies
-
1:
Rp3.904.364
-
1On Order
|
Mouser Part No
739-A10237-21
|
Laird Technologies
|
Thermal Interface Products Tputty 502 80 FG2 9x9" 3W/mK XSoft
|
|
1On Order
|
|
|
Rp3.904.364
|
|
|
Rp3.561.556
|
|
|
View
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
Boron Nitride
|
3 W/m-K
|
5 kVAC
|
White
|
- 45 C
|
+ 200 C
|
|
|
0.08 in
|
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502-020 FG2 9" x 9" sheet
- A10538-17
- Laird Technologies
-
1:
Rp1.336.197
-
|
Mouser Part No
739-A10538-17
|
Laird Technologies
|
Thermal Interface Products Tputty 502-020 FG2 9" x 9" sheet
|
|
|
|
|
Rp1.336.197
|
|
|
Rp1.183.098
|
|
|
Rp1.141.758
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 1
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
Thermal Pad
|
Boron Nitride
|
3 W/m-K
|
2 kVAC
|
White
|
- 45 C
|
+ 200 C
|
229 mm
|
229 mm
|
0.51 mm
|
10 psi
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 500cc bulk
- A10548-6
- Laird Technologies
-
1:
Rp9.150.706
-
|
Mouser Part No
739-A10548-6
|
Laird Technologies
|
Thermal Interface Products Tputty 502 500cc bulk
|
|
|
|
|
Rp9.150.706
|
|
|
Rp9.078.010
|
|
Min.: 1
Mult.: 1
|
|
|
Thermally Conductive Adhesives
|
|
Boron Nitride
|
|
|
White
|
- 45 C
|
+ 200 C
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 40 FG2 18x18" 3W/mK XSoft
- A10233-31
- Laird Technologies
-
4:
Rp7.987.051
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10233-31
|
Laird Technologies
|
Thermal Interface Products Tputty 502 40 FG2 18x18" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp7.987.051
|
|
|
Rp7.832.201
|
|
Min.: 4
Mult.: 1
|
|
|
Thermally Conductive Adhesives
|
|
Boron Nitride
|
3 W/m-K
|
4 kVAC
|
White
|
- 45 C
|
+ 200 C
|
|
|
1.02 mm
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 50 FG2 9x9" 3W/mK XSoft
- A10234-31
- Laird Technologies
-
8:
Rp2.644.016
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10234-31
|
Laird Technologies
|
Thermal Interface Products Tputty 502 50 FG2 9x9" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp2.644.016
|
|
|
Rp2.468.496
|
|
|
Rp2.351.307
|
|
|
Quote
|
|
|
Quote
|
|
Min.: 8
Mult.: 1
|
|
|
Thermally Conductive Adhesives
|
Thermal Pad
|
Boron Nitride
|
3 W/m-K
|
5 kVAC
|
White
|
- 45 C
|
+ 200 C
|
229 mm
|
229 mm
|
1.27 mm
|
10 psi
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 50 FG2 18x18" 3W/mK XSoft
- A10234-38
- Laird Technologies
-
4:
Rp9.405.403
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10234-38
|
Laird Technologies
|
Thermal Interface Products Tputty 502 50 FG2 18x18" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
Min.: 4
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
|
3 W/m-K
|
|
|
|
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 60 FG2 18x18" 3W/mK XSoft
- A10235-36
- Laird Technologies
-
1:
Rp11.285.152
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10235-36
|
Laird Technologies
|
Thermal Interface Products Tputty 502 60 FG2 18x18" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp11.285.152
|
|
|
Rp10.945.147
|
|
Min.: 1
Mult.: 1
|
|
|
Thermally Conductive Adhesives
|
|
Boron Nitride
|
3 W/m-K
|
5 kVAC
|
White
|
- 45 C
|
+ 200 C
|
457 mm
|
457 mm
|
2.03 mm
|
|
UL 94 HB
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 70 FG2 9x9" 3W/mK XSoft
- A10236-04
- Laird Technologies
-
5:
Rp3.458.556
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10236-04
|
Laird Technologies
|
Thermal Interface Products Tputty 502 70 FG2 9x9" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
Min.: 5
Mult.: 1
|
|
|
Thermally Conductive Adhesives
|
|
Boron Nitride
|
3 W/m-K
|
|
White
|
- 45 C
|
+ 200 C
|
|
|
0.5 mm to 5 mm
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 70 FG2 18x18" 3W/mK XSoft
- A10236-05
- Laird Technologies
-
4:
Rp12.621.874
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10236-05
|
Laird Technologies
|
Thermal Interface Products Tputty 502 70 FG2 18x18" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp12.621.874
|
|
|
Rp12.501.533
|
|
Min.: 4
Mult.: 1
|
|
|
Thermally Conductive Adhesives
|
|
Boron Nitride
|
3 W/m-K
|
5 kVAC
|
White
|
- 45 C
|
+ 200 C
|
457 mm
|
457 mm
|
1.778 mm
|
|
UL 94 HB
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 80 FG2 18x18" 3W/mK XSoft
- A10237-22
- Laird Technologies
-
1:
Rp14.341.168
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10237-22
|
Laird Technologies
|
Thermal Interface Products Tputty 502 80 FG2 18x18" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp14.341.168
|
|
|
Rp14.244.824
|
|
Min.: 1
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
|
3 W/m-K
|
|
|
|
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 90 FG2 18x18" 3W/mK XSoft
- A10238-08
- Laird Technologies
-
4:
Rp15.815.749
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10238-08
|
Laird Technologies
|
Thermal Interface Products Tputty 502 90 FG2 18x18" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp15.815.749
|
|
|
Rp15.743.929
|
|
Min.: 4
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
|
3 W/m-K
|
|
|
|
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 90 FG2 9x9" 3W/mK XSoft
- A10238-09
- Laird Technologies
-
1:
Rp4.299.372
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10238-09
|
Laird Technologies
|
Thermal Interface Products Tputty 502 90 FG2 9x9" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
Min.: 1
Mult.: 1
|
|
|
Thermally Conductive Adhesives
|
Thermal Pad
|
Boron Nitride
|
3 W/m-K
|
5 kVAC
|
White
|
- 45 C
|
+ 200 C
|
229 mm
|
229 mm
|
2.28 mm
|
10 psi
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502,FG2,100 9" x 9"
- A10239-09
- Laird Technologies
-
1:
Rp4.823.131
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10239-09
|
Laird Technologies
|
Thermal Interface Products Tputty 502,FG2,100 9" x 9"
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp4.823.131
|
|
|
Rp4.513.080
|
|
|
Rp4.446.165
|
|
Min.: 1
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
Thermal Pad
|
Boron Nitride
|
3 W/m-K
|
5 kVAC
|
White
|
- 45 C
|
+ 200 C
|
229 mm
|
229 mm
|
2.54 mm
|
10 psi
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502,FG2,110 9" x 9"
- A10240-05
- Laird Technologies
-
4:
Rp4.777.236
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10240-05
|
Laird Technologies
|
Thermal Interface Products Tputty 502,FG2,110 9" x 9"
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp4.777.236
|
|
|
Rp4.768.127
|
|
|
Rp4.767.252
|
|
Min.: 4
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
Thermal Pad
|
Boron Nitride
|
3 W/m-K
|
|
White
|
- 45 C
|
+ 200 C
|
229 mm
|
229 mm
|
2.79 mm
|
10 psi
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 FG2 120 9" x 9"
- A10241-09
- Laird Technologies
-
4:
Rp5.562.523
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10241-09
|
Laird Technologies
|
Thermal Interface Products Tputty 502 FG2 120 9" x 9"
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp5.562.523
|
|
|
Rp5.251.597
|
|
Min.: 4
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
Boron Nitride
|
3 W/m-K
|
5 kVAC
|
White
|
- 45 C
|
+ 200 C
|
229 mm
|
229 mm
|
0.12 in
|
|
UL 94 V-0
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 130 FG2 9x9" 3W/mK XSoft
- A10242-04
- Laird Technologies
-
1:
Rp5.698.806
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10242-04
|
Laird Technologies
|
Thermal Interface Products Tputty 502 130 FG2 9x9" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp5.698.806
|
|
|
Rp5.585.471
|
|
Min.: 1
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
|
3 W/m-K
|
|
|
|
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 140 FG2 9x9" 3W/mK XSoft
- A10243-04
- Laird Technologies
-
4:
Rp6.163.707
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10243-04
|
Laird Technologies
|
Thermal Interface Products Tputty 502 140 FG2 9x9" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp6.163.707
|
|
|
Rp5.966.115
|
|
Min.: 4
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
|
3 W/m-K
|
|
|
|
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 150 FG2 9x9" 3W/mK XSoft
- A10244-06
- Laird Technologies
-
4:
Rp6.344.307
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10244-06
|
Laird Technologies
|
Thermal Interface Products Tputty 502 150 FG2 9x9" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp6.344.307
|
|
|
Rp6.290.004
|
|
Min.: 4
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
|
3 W/m-K
|
|
|
|
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 160 FG2 9x9" 3W/mK XSoft
- A10245-06
- Laird Technologies
-
4:
Rp7.189.152
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10245-06
|
Laird Technologies
|
Thermal Interface Products Tputty 502 160 FG2 9x9" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp7.189.152
|
|
|
Rp6.787.137
|
|
Min.: 4
Mult.: 1
|
|
|
Thermally Conductive Adhesives
|
|
Boron Nitride
|
3 W/m-K
|
5 kVAC
|
White
|
- 45 C
|
+ 200 C
|
229 mm
|
229 mm
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 170 FG2 9x9" 3W/mK XSoft
- A10246-04
- Laird Technologies
-
4:
Rp7.427.033
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10246-04
|
Laird Technologies
|
Thermal Interface Products Tputty 502 170 FG2 9x9" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp7.427.033
|
|
|
Rp7.216.829
|
|
Min.: 4
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
|
3 W/m-K
|
|
|
|
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 180 FG2 9x9" 3W/mK XSoft
- A10247-04
- Laird Technologies
-
4:
Rp7.862.681
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10247-04
|
Laird Technologies
|
Thermal Interface Products Tputty 502 180 FG2 9x9" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
|
Rp7.862.681
|
|
|
Rp7.707.480
|
|
Min.: 4
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
|
3 W/m-K
|
|
|
|
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|
|
|
Thermal Interface Products Tputty 502 180 FG2 18x18" 3W/mK XSoft
- A10247-05
- Laird Technologies
-
4:
Rp30.831.497
-
Non-Stocked Lead-Time 10 Weeks
|
Mouser Part No
739-A10247-05
|
Laird Technologies
|
Thermal Interface Products Tputty 502 180 FG2 18x18" 3W/mK XSoft
|
|
Non-Stocked Lead-Time 10 Weeks
|
|
Min.: 4
Mult.: 1
|
|
|
Gap Fillers / Gap Pads / Sheets
|
|
|
|
|
|
|
|
|
|
|
|
|
Tputty 502
|
Bulk
|
|