387000866

Tark Thermal Solutions
739-387000866
387000866

Mfr.:

Description:
Thermoelectric Assemblies Heat Exchanger for Medical Equipment/Instrumentation, 29W, 3.78x2.56x3.43 Inch

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Product Attribute Attribute Value Select Attribute
Tark Thermal Solutions
Product Category: Thermoelectric Assemblies
Delivery Restrictions:
 Due to size or weight of the product, your shipping charge may increase.
RoHS:  
Direct-to-Air
29 W
3.2 A
15 V
Brand: Tark Thermal Solutions
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Height: 87 mm
Length: 98 mm
Maximum Operating Temperature: + 50 C
Minimum Operating Temperature: - 10 C
Product Type: Thermoelectric Peltier Assemblies (TEC)
Series: DAT
Factory Pack Quantity: 1
Subcategory: Thermoelectric
Tradename: Tunnel
Width: 65 mm
Part # Aliases: DAT,029,12VDC DAT-029-12-02-00-00, DAT-029-12VDC DAT-029-12-02-00-00
Unit Weight: 52,2 kg
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Laird Thermal Systems is now Tark Thermal Solutions.

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further information.

5-0525-3

Datasheet

USHTS:
8419899540
ECCN:
EAR99

Tunnel Series Thermoelectric Assemblies (TEAs)

Tark Tunnel Series Thermoelectric Assemblies (TEAs) offer a patented high-performance cross-flow technology that maximizes heat transfer when pulling air through a heat exchanger. These thermoelectric assemblies minimize the number of airflow paths required to operate compared to traditional impingement flow TEAs. Tark Tunnel Series TEAs are available in two heat transfer mechanism configurations.

DAT Thermoelectric Cooler Assemblies

Tark Thermal Solutions Direct-to-Air Tunnel (DAT) Thermoelectric Cooler Assemblies (TEAs) provide a compact, reliable performance by cooling objects through conduction. The heat is absorbed by a cold plate and dissipated through a high-density heat exchanger equipped with an air ducted shroud and a brand-name fan. Tark DAT thermoelectric cooler assemblies minimize the number of airflow paths required to operate. The thermoelectric cooler modules are custom designed to achieve a high coefficient of performance (CoP) to minimize power consumption and generate heat pumping action. Applications include medical diagnostics, semiconductor fabrication, food and beverage cooling, and industrial instrumentation.

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