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TEMA-AA-50-12

Name: Wakefield Thermal TEMA-AA-50-12
Brand: Wakefield Thermal
SKU: 567-TEMA-AA-50-12
Price: 4528494.84 IDR
Availability: InStock

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Mouser No:

567-TEMA-AA-50-12

Mfr. No:

TEMA-AA-50-12

Mfr.:

Wakefield Thermal

Description:

Thermoelectric Assemblies Thermoelectric Assembly, Direct-Air to Air, 12VDC, 50W, 8A, 160x122.4x147mm

Datasheet:

TEMA-AA-50-12 Datasheet (PDF)

ECAD Model:

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Learn more about Wakefield Thermal TEMA-AA-50-12

In Stock: 9

Stock:: 9

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On Order:: 10
Factory Lead Time:: 16

Weeks Estimated factory production time for quantities greater than shown.

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Pricing (IDR)

Qty.	Unit Price	Ext. Price
	Rp4.528.494,84	Rp4.528.494,84
	Rp3.634.251,99	Rp18.171.259,95
	Rp3.130.463,07	Rp31.304.630,70
	Rp3.130.287,90	Rp93.908.637,00
	Rp3.130.112,73	Rp156.505.636,50
100	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Wakefield Thermal
Product Category:	Thermoelectric Assemblies
RoHS:
Type:	Air-to-Air
Cooling Power:	50 W
Maximum Current:	8 A
Maximum Voltage:	12 V
Brand:	Wakefield Thermal
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Height:	147.5 mm
Length:	160 mm
Maximum Operating Temperature:	+ 60 C
Minimum Operating Temperature:	- 20 C
Product Type:	Thermoelectric Peltier Assemblies (TEC)
Series:	TEMA
Factory Pack Quantity:	10
Subcategory:	Thermoelectric
Width:	122.4 mm
Unit Weight:	1,812 kg

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Datasheet

TEMA-AA-50-12 Datasheet (PDF)

PCN

RoHS Certificate (PDF)

USHTS:: 8418690180
ECCN:: EAR99

Air-to-Air Thermoelectric Cooler Assemblies

Wakefield Thermal Air-to-Air Thermoelectric Cooler Assemblies are usually used to cool (or heat) objects in enclosures. A 12V_DC (TEMA-AA-50-12) and 24V_DC (TEMA-AA-50-24) version are available. Heat is absorbed and dissipated by heat exchangers equipped with fans. The compact and dependable coolers are essentially maintenance-free with no filters to change. These Wakefield Thermal devices can maintain ambient temperatures while removing up to 50W and can be mounted in any orientation, offering design flexibility with solid-state reliability.