New Thermal Interface Products
Laird Technologies Tflex SF4 Thermal Gap Fillers are silicon-free and offer a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity. These gap fillers provide products with excellent deflection properties, providing minimal pressure on components during deflection. A minimal amount of pressure is required to reach the lowest possible thermal resistance. Laird Technologies Tflex SF4 Thermal Gap Fillers are designed for datacom systems, automotive electronics, optical modules, and cameras.
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Laird Technologies Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.10/09/2024
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Laird Technologies Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.10/09/2024 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.30/05/2024 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.27/05/2024 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.18/01/2024 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.30/10/2023 -
LeaderTech TCF Ultra-Thin Carbon Fibre Thermal PadsLow thermal resistance, soft surface, and mainly uses carbon fibre as a thermally conductive filler.18/10/2023 -
LeaderTech TGN Ultra-Thin Thermal PadsFeatures low thermal resistance and is manufactured by combining graphene and silicone.18/10/2023 -
LeaderTech TCI Composite Indium SheetTransitions from solid to liquid at its melting point and back to solid again at room temperature.18/10/2023 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.27/09/2023 -
Laird Technologies CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.08/09/2023 -
Bergquist Company Data Centre ApplicationsAdvanced materials help with thermal management, long-term reliability, and stress protection.01/04/2023 -
Laird Technologies Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.03/08/2022 -
Laird Technologies Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.03/08/2022 -
Laird Technologies Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.19/07/2022 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.11/07/2022 -
Laird Technologies Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.03/06/2022 -
Bergquist Company EV Charging SolutionsDesigned to provide safe charging while protecting EV battery packs from thermal/electrical events.13/04/2022 -
Laird Technologies Tflex™ RB300 Thermal Gap FillerExceptionally soft gap filler pads with a thermal conductivity of 1.2 W/mK.30/03/2022